Apple (company)Píngguǒ苹果and / withyǔ与Intel (company)Yīngtèěr英特尔to reach / to achievedáchéng达成preliminary / initialchūbù初步microchipxīnpiàn芯片to manufacturezhìzào制造agreement / dealxiéyì协议。
Apple (company)
Píngguǒ
苹果
and / with
yǔ
与
Intel (company)
Yīngtèěr
英特尔
to reach / to achieve
dáchéng
达成
preliminary / initial
chūbù
初步
microchip
xīnpiàn
芯片
to manufacture
zhìzào
制造
agreement / deal
xiéyì
协议
Apple (company)
Píngguǒ
苹果
and / with
yǔ
与
Intel (company)
Yīngtèěr
英特尔
according to reports
jù bàodào
据报道
already
yǐ
已
to reach / to achieve
dáchéng
达成
preliminary / initial
chūbù
初步
agreement / deal
xiéyì
协议
by / from
yóu
由
Intel (company)
Yīngtèěr
英特尔
for / to
wèi
为
Apple (company)
Píngguǒ
苹果
devices / equipment
shèbèi
设备
to manufacture on contract / foundry work
dàigōng
代工
microchip
xīnpiàn
芯片
this
zhè
这
will be
jiāng shì
将是
Intel (company)
Yīngtèěr
英特尔
contract manufacturing
dàigōng
代工
business / operations
yèwù
业务
up to now / so far
qìjīn
迄今
most important / most significant
zuì zhòngyào
最重要
(structural particle)
de
的
contract
hétong
合同