TSMC (Taiwan Semiconductor Manufacturing Company)Táijīdiàn台积电atzài在in 20262026 nián2026年North AmericaBěi Měi北美technologyjìshù技术symposium / technology conferenceyántǎo huì研讨会at (a venue/event)shàng上to unveil / to releasefābù发布A13 (chip process node)A13A13chip / semiconductorxīnpiàn芯片manufacturing process / process nodezhìchéng制程。
TSMC (Taiwan Semiconductor Manufacturing Company)
Táijīdiàn
台积电
at
zài
在
in 2026
2026 nián
2026年
North America
Běi Měi
北美
technology
jìshù
技术
symposium / technology conference
yántǎo huì
研讨会
at (a venue/event)
shàng
上
to unveil / to release
fābù
发布
A13 (chip process node)
A13
A13
chip / semiconductor
xīnpiàn
芯片
manufacturing process / process node
zhìchéng
制程
TSMC (Taiwan Semiconductor Manufacturing Company)
Táijīdiàn
台积电
on / at (formal)
yú
于
April 22nd
sì yuè èrshí èr rì
4月22日
at
zài
在
the United States
Měiguó
美国
California
Jiāzhōu
加州
Santa Clara (city in California)
Shèngkèlālā
圣克拉拉
held / hosted
jǔbàn de
举办的
annual
niándù
年度
technology
jìshù
技术
symposium / conference
yántǎo huì
研讨会
at (a venue)
shàng
上
formally / officially
zhèngshì
正式
to unveil / to announce
fābù
发布
(completion marker)
le
了
its
qí
其
latest / newest
zuìxīn
最新
A13 (chip process node)
A13
A13
manufacturing process node
zhìchéng
制程
process technology
gōngyì
工艺
A13 (chip process node)
A13
A13
process technology
gōngyì
工艺
is planned to
jìhuà
计划
in (formal)
yú
于
in 2029
2029 nián
2029年
to enter
jìnrù
进入
mass production / volume production
liàngchǎn
量产
stage / phase
jiēduàn
阶段
mainly / primarily
zhǔyào
主要
to serve / to cater to
fúwù yú
服务于
artificial intelligence
rén gōng zhìnéng
人工智能
and
hé
和
high-performance computing / HPC
gāo xìngnéng jìsuàn
高性能计算
field / domain
lǐngyù
领域
(possessive particle)
de
的
customers / clients
kèhù
客户
demand / needs
xūqiú
需求