汉字News

← 汉字NewsChinese News for Learners
technology
kē jì
科技
·HSK 5

TSMC (Taiwan Semiconductor Manufacturing Company)
Táijīdiàn
台积电
at
zài
在
in 2026
2026 nián
2026年
North America
Běi Měi
北美
technology
jìshù
技术
symposium / technology conference
yántǎo huì
研讨会
at (a venue/event)
shàng
上
to unveil / to release
fābù
发布
A13 (chip process node)
A13
A13
chip / semiconductor
xīnpiàn
芯片
manufacturing process / process node
zhìchéng
制程
。

TSMC (Taiwan Semiconductor Manufacturing Company)
Táijīdiàn
台积电
on / at (formal)
yú
于
April 22nd
sì yuè èrshí èr rì
4月22日
at
zài
在
the United States
Měiguó
美国
California
Jiāzhōu
加州
Santa Clara (city in California)
Shèngkèlālā
圣克拉拉
held / hosted
jǔbàn de
举办的
annual
niándù
年度
technology
jìshù
技术
symposium / conference
yántǎo huì
研讨会
at (a venue)
shàng
上
，
formally / officially
zhèngshì
正式
to unveil / to announce
fābù
发布
(completion marker)
le
了
its
qí
其
latest / newest
zuìxīn
最新
A13 (chip process node)
A13
A13
manufacturing process node
zhìchéng
制程
process technology
gōngyì
工艺
。
A13 (chip process node)
A13
A13
process technology
gōngyì
工艺
is planned to
jìhuà
计划
in (formal)
yú
于
in 2029
2029 nián
2029年
to enter
jìnrù
进入
mass production / volume production
liàngchǎn
量产
stage / phase
jiēduàn
阶段
，
mainly / primarily
zhǔyào
主要
to serve / to cater to
fúwù yú
服务于
artificial intelligence
rén gōng zhìnéng
人工智能
and
hé
和
high-performance computing / HPC
gāo xìngnéng jìsuàn
高性能计算
field / domain
lǐngyù
领域
(possessive particle)
de
的
customers / clients
kèhù
客户
demand / needs
xūqiú
需求
。

April 23, 2026 at 7:00 AM

TSMC (Taiwan Semiconductor Manufacturing Company)
Táijīdiàn
台积电
on / at (formal)
yú
于
April 22nd
sì yuè èrshí èr rì
4月22日
at
zài
在
the state of California
Jiālìfúníyà zhōu
加利福尼亚州
Santa Clara
Shèngkèlālā
圣克拉拉
to host / to hold
jǔbàn
举办
(completion marker)
le
了
2026
2026 nián
2026年
North America
Běi Měi
北美
technology
jìshù
技术
symposium / conference
yántǎo huì
研讨会
，
theme
zhǔtí
主题
is / being
wèi
为
expanding AI with leadership silicon
yǐ lǐngxiān xīnpiàn kuòzhǎn rén gōng zhìnéng
「以领先芯片扩展人工智能」
。
the symposium
yántǎo huì
研讨会
at (an event)
shàng
上
，
TSMC
Táijīdiàn
台积电
formally / officially
zhèngshì
正式
to unveil / to announce
fābù
发布
(completion marker)
le
了
next-generation
xīn yī dài
新一代
A13 (chip process node)
A13
A13
manufacturing process node
zhìchéng
制程
process technology
gōngyì
工艺
，
this is
zhè shì
这是
its
qí
其
industry-leading
hángyè lǐngxiān
行业领先
A14 (chip process node)
A14
A14
process technology
gōngyì
工艺
(possessive / relative clause marker)
de
的
direct
zhíjiē
直接
shrink version / scaled-down version
suōxiǎo bǎnběn
缩小版本
。
compared with / versus
yǔ
与
A14 (chip process node)
A14
A14
compared to
xiāngbǐ
相比
，
A13 (chip process node)
A13
A13
in terms of
zài
在
chip
xīnpiàn
芯片
area / footprint
miànjī
面积
(topic marker)
shàng
上
can / is able to
kě
可
to achieve
shíxiàn
实现
6 percent
bǎifēnzhī liù
6%
(possessive particle)
de
的
reduction / shrink
suōjiǎn
缩减
，
and / also
bìng
并
to maintain
bǎochí
保持
fully / completely
wánquán
完全
compatible
jiānróng
兼容
(possessive particle)
de
的
design
shèjì
设计
rules / specifications
guīzé
规则
。
TSMC
Táijīdiàn
台积电
stated / indicated
biǎoshì
表示
，
A13 (chip process node)
A13
A13
manufacturing process node
zhìchéng
制程
will (at a time)
jiāng yú
将于
in 2029
2029 nián
2029年
to enter
jìnrù
进入
volume production / mass production
liàngchǎn
量产
stage
jiēduàn
阶段
，
than / compared with
bǐ
比
A14 (chip process node)
A14
A14
later
wǎn
晚
one year
yī nián
一年
。
new
xīn
新
process technology
gōngyì
工艺
primarily / mainly
zhǔyào
主要
targeting / oriented toward
miànxiàng
面向
artificial intelligence
rén gōng zhìnéng
人工智能
、
high-performance computing
gāo xìngnéng jìsuàn
高性能计算
as well as
yǐjí
以及
mobile
yídòng
移动
applications
yìngyòng
应用
field / domain
lǐngyù
领域
increasingly / ever-growing
rìyì
日益
growing
zēngzhǎng de
增长的
computing power
suànlì
算力
demand
xūqiú
需求
。
in addition / furthermore
cǐwài
此外
，
TSMC
Táijīdiàn
台积电
also
hái
还
to showcase / to demonstrate
zhǎnshì
展示
(completion marker)
le
了
its
qí
其
in
zài
在
multi-chip / chiplet
duō xīnpiàn
多芯片
packaging
fēngzhuāng
封装
technology
jìshù
技术
and
hé
和
silicon photonics
guī guāngzǐ
硅光子
technology
jìshù
技术
field
lǐngyù
领域
(possessive particle)
de
的
latest
zuìxīn
最新
progress / advances
jìnzhǎn
进展
。
multi-chip / chiplet
duō xīnpiàn
多芯片
packaging
fēngzhuāng
封装
technology
jìshù
技术
(passive marker)
bèi
被
considered to be
rènwéi
认为
is
shì
是
to extend / to continue
yánxù
延续
Moore Law
Móěr dìnglǜ
摩尔定律
(possessive particle)
de
的
important
zhòngyào
重要
path / approach
lùjìng
路径
，
to allow / to enable
yǔnxǔ
允许
to (do something)
jiāng
将
multiple
duō gè
多个
chips
xīnpiàn
芯片
to integrate
jíchéng
集成
in / within
zài
在
the same
tóngyī
同一
package
fēngzhuāng
封装
inside / within
nèi
内
。
this (event / occasion)
cǐ cì
此次
symposium
yántǎo huì
研讨会
is
shì
是
TSMC
Táijīdiàn
台积电
scale / size
guīmó
规模
largest
zuì dà de
最大的
annual
niándù
年度
customer
kèhù
客户
event
huódòng
活动
，
to attract
xīyǐn
吸引
(completion marker)
le
了
global / worldwide
quánqiú
全球
chip
xīnpiàn
芯片
design
shèjì
设计
and
hé
和
manufacturing
zhìzào
制造
field / sector
lǐngyù
领域
(possessive particle)
de
的
numerous / many
zhòngduō
众多
enterprises / companies
qǐyè
企业
to participate / to attend
cānyù
参与
。

New Words

Táijīdiàn
台积电
TSMC
yántǎo huì
研讨会
symposium
zhìchéng
制程
manufacturing process
gōngyì
工艺
process technology
suōjiǎn
缩减
reduction
jiānróng
兼容
compatible
liàngchǎn
量产
mass production
duō xīnpiàn
多芯片
multi-chip
guī guāngzǐ
硅光子
silicon photonics

News in English

Science & Technology

TSMC Unveils A13 Chip Process Technology at 2026 North America Technology Symposium

TSMC debuted its A13 process technology at its 2026 North America Technology Symposium in Santa Clara, California, targeting 2029 volume production for next-generation AI and high-performance computing chips.

TSMC held its 2026 North America Technology Symposium in Santa Clara, California on April 22nd. The event theme was "Expanding AI with Leadership Silicon." At the symposium, TSMC formally unveiled its next-generation A13 manufacturing process technology, which is a scaled-down version of their industry-leading A14 process. Compared to A14, the A13 can achieve a 6% reduction in chip area while maintaining fully compatible design rules. TSMC stated that the A13 process will enter mass production in 2029, one year later than A14. The new process is primarily targeting artificial intelligence, high-performance computing, and mobile applications with growing computing power demands. Additionally, TSMC showcased its latest developments in multi-chip packaging technology and silicon photonics. Multi-chip packaging technology is considered an important path to extend Moore's Law, allowing multiple chips to be integrated within the same package. This North America Technology Symposium is TSMC's largest annual customer event, attracting numerous enterprises from the global chip design and manufacturing sectors.

More in Science & Technology

MiniMax
MiniMax
MiniMax
releases
fābu
发布
M3
M3
M3
multimodal
duōmótài
多模态
model
móxíng
模型
。

MiniMax M3 Multimodal Model Delivers 9x Faster Performance

Nvidia
yīngwěidá
英伟达
releases
fābu
发布
Cosmos
Cosmos
Cosmos
3
3
3
open-source
kāiyuán
开源
physical
wùlǐ
物理
AI
réngōng zhìnéng
人工智能
model
móxíng
模型
。

Nvidia Releases Cosmos 3 Open-Source Physical AI Model

Apple (company)
Píngguǒ
苹果
to release / to launch
fābù
发布
brand new / completely new
quánxīn
全新
Siri (Apple voice assistant)
Siri
Siri
，
features / functions
gōngnéng
功能
greatly / significantly
dàfú
大幅
to upgrade / upgraded
shēngjí
升级
。

Apple Unveils Completely Rebuilt Siri at WWDC 2026

Germany
Déguó
德国
robot / robotics
jīqìrén
机器人
company
gōngsī
公司
Neura Robotics (German humanoid robot company)
Neura Robotics
Neura Robotics
to complete / to close
wánchéng
完成
$1.4 billion
14 yì měiyuán
14亿美元
funding round
róngzī
融资
。

German Robotics Firm Neura Robotics Closes $1.4 Billion Funding Round