TSMC (Taiwan Semiconductor Manufacturing Company)

Táijīdiàn

台积电

at

zài

在

in 2026

2026 nián

2026年

North America

Běi Měi

北美

technology

jìshù

技术

symposium / technology conference

yántǎo huì

研讨会

at (a venue/event)

shàng

上

to unveil / to release

fābù

发布

A13 (chip process node)

A13

A13

chip / semiconductor

xīnpiàn

芯片

manufacturing process / process node

zhìchéng

制程

。

New Words

News in English

TSMC Unveils A13 Chip Process Technology at 2026 North America Technology Symposium

TSMC debuted its A13 process technology at its 2026 North America Technology Symposium in Santa Clara, California, targeting 2029 volume production for next-generation AI and high-performance computing chips.

TSMC held its 2026 North America Technology Symposium in Santa Clara, California on April 22nd. The event theme was "Expanding AI with Leadership Silicon." At the symposium, TSMC formally unveiled its next-generation A13 manufacturing process technology, which is a scaled-down version of their industry-leading A14 process. Compared to A14, the A13 can achieve a 6% reduction in chip area while maintaining fully compatible design rules. TSMC stated that the A13 process will enter mass production in 2029, one year later than A14. The new process is primarily targeting artificial intelligence, high-performance computing, and mobile applications with growing computing power demands. Additionally, TSMC showcased its latest developments in multi-chip packaging technology and silicon photonics. Multi-chip packaging technology is considered an important path to extend Moore's Law, allowing multiple chips to be integrated within the same package. This North America Technology Symposium is TSMC's largest annual customer event, attracting numerous enterprises from the global chip design and manufacturing sectors.

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