ChangXin Memory Technologies (Chinese DRAM maker)Cháng Xīn Cúnchǔ长鑫存储at / in (location marker)zài在ShanghaiShànghǎi上海STAR Market (Shanghai tech innovation board)Kēchuàng bǎn科创板to be listed on the stock marketshàngshì上市,first day of tradingshǒurì首日share pricegǔjià股价to surge sharply / to skyrocketbàozhǎng暴涨approximatelyyuē约470 percent470%470%。
ChangXin Memory Technologies (Chinese DRAM maker)
Cháng Xīn Cúnchǔ
长鑫存储
at / in (location marker)
zài
在
Shanghai
Shànghǎi
上海
STAR Market (Shanghai tech innovation board)
Kēchuàng bǎn
科创板
to be listed on the stock market
shàngshì
上市
first day of trading
shǒurì
首日
share price
gǔjià
股价
to surge sharply / to skyrocket
bàozhǎng
暴涨
approximately
yuē
约
470 percent
470%
470%
China
Zhōngguó
中国
the largest
zuìdà
最大
memory (computing)
nèicún
内存
chip / semiconductor
xīnpiàn
芯片
manufacturer / maker
zhìzàoshāng
制造商
ChangXin Memory Technologies
Cháng Xīn Cúnchǔ
长鑫存储
July 27
qī yuè èrshíqī rì
7月27日
to make its debut on
dēnglù
登陆
Shanghai
Shànghǎi
上海
STAR Market
Kēchuàng bǎn
科创板
first day of trading
shǒurì
首日
share price
gǔjià
股价
to surge sharply
bàozhǎng
暴涨
approximately
yuē
约
470 percent
470%
470%
total market capitalization
zǒng shìzhí
总市值
reaching approximately
yuē dá
约达
3.3 trillion yuan (CNY)
3.3 wànyì yuán rénmínbì
3.3万亿元人民币
this time / this particular
cǐcì
此次
IPO (initial public offering)
IPO
IPO
fundraising / funds raised
mùzī
募资
approximately
yuē
约
66 billion yuan
660 yì yuán
660亿元
to be / is
shì
是
this year
jīnnián
今年
Asia
Yàzhōu
亚洲
scale / size
guīmó
规模
the largest
zuìdà
最大
(structural particle)
de
的
initial public offering (IPO)
shǒucì gōngkāi mùgǔ
首次公开募股
July 29, 2026 at 12:00 PM
ChangXin Memory Technologies
Cháng Xīn Cúnchǔ
长鑫存储
to be / is
shì
是
China
Zhōngguó
中国
the largest
zuìdà
最大
(structural particle)
de
的
memory (computing)
nèicún
内存
chip / semiconductor
xīnpiàn
芯片
company
gōngsī
公司
headquarters
zǒngbù
总部
located at / situated in
wèiyú
位于
Anhui Province
Ānhuī shěng
安徽省
Hefei City
Héféi shì
合肥市
July 27
qī yuè èrshíqī rì
7月27日
this (for companies)
zhè jiā
这家
company
gōngsī
公司
officially / formally
zhèngshì
正式
at / on
zài
在
Shanghai Stock Exchange
Shànghǎi Zhèngquàn Jiāoyìsuǒ
上海证券交易所
STAR Market
Kēchuàng bǎn
科创板
to be listed
guàpái
挂牌
to go public
shàngshì
上市
stock listing
shàngshì
上市
first day of trading
shǒurì
首日
share price
gǔjià
股价
from
cóng
从
issue price / IPO price
fāxíngjià
发行价
8.66 yuan per share
8.66 yuán
8.66元
to rise / to increase
shàngzhǎng
上涨
to / reaching
zhì
至
approximately
yuē
约
49 yuan per share
49 yuán
49元
gain / increase rate
zhǎngfú
涨幅
close to / approaching
jiējìn
接近
470 percent
470%
470%
this time / this particular
cǐcì
此次
IPO (initial public offering)
IPO
IPO
to raise capital
mùzī
募资
approximately
yuē
约
66 billion yuan (CNY)
660 yì yuán rénmínbì
660亿元人民币
to be / is
shì
是
this year
jīnnián
今年
Asia
Yàzhōu
亚洲
scale / size
guīmó
规模
the largest
zuìdà
最大
(structural particle)
de
的
initial public offering (IPO)
shǒucì gōngkāi mùgǔ
首次公开募股
stock listing
shàngshì
上市
after / following
hòu
后
ChangXin Memory Technologies
Cháng Xīn Cúnchǔ
长鑫存储
(structural particle)
de
的
total market capitalization
zǒng shìzhí
总市值
amounting to approximately
yuē wéi
约为
3.3 trillion yuan (CNY)
3.3 wànyì yuán rénmínbì
3.3万亿元人民币
equivalent to approximately
yuē hé
约合
$480 billion USD
4800 yì měiyuán
4800亿美元
this (company)
zhè jiā
这家
company
gōngsī
公司
now
xiànzài
现在
to be / is
shì
是
China
Zhōngguó
中国
market capitalization
shìzhí
市值
highest / top
zuìgāo
最高
(structural particle)
de
的
tech company
kējì gōngsī
科技公司
one of
zhī yī
之一
in / at
zài
在
global / worldwide
quánqiú
全球
market
shìchǎng
市场
on (location particle)
shàng
上
ChangXin Memory Technologies
Cháng Xīn Cúnchǔ
长鑫存储
currently / at present
mùqián
目前
to be
shì
是
the fourth-largest
dì sì dà
第四大
DRAM (dynamic random-access memory)
DRAM
DRAM
memory chip
nèicún
内存
producer / manufacturer
shēngchǎnshāng
生产商
the company
gōngsī
公司
to state / to indicate
biǎoshì
表示
will (future marker)
jiāng
将
to use / using
yòng
用
the raised funds
mùjí zījīn
募集资金
to expand
kuòdà
扩大
production scale
shēngchǎn guīmó
生产规模
to increase / to intensify
jiādà
加大
R&D / research and development
yánfā
研发
investment / input
tóurù
投入
News in English
Science & TechnologyCXMT Shares Surge 470% in Historic Shanghai STAR Market Debut
China largest DRAM maker CXMT debuted on the Shanghai STAR Market on July 27, with shares surging about 470% to push market capitalization to 3.3 trillion yuan. The IPO raised about 66 billion yuan, making it Asia largest share offering of the year.
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former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal
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Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement
Tencent (Chinese tech company)Téngxùn腾讯from / towardxiàng向Oracle (US tech corporation)Jiǎgǔwén甲骨文to lease / to rent for usezūyòng租用one hundred thousandshí wàn十万measure word for small round objectskē颗artificial intelligenceréngōng zhìnéng人工智能semiconductor chip / microchipxīnpiàn芯片。
Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal
Apple Inc.Píngguǒ Gōngsī苹果公司to announcexuānbù宣布will (future marker)jiāng将on / at (preceding a date)yú于October 13thshíyuè shísān rì十月十三日to hold (an event)jǔxíng举行Welcome Home (name of Apple event)Welcome HomeWelcome Homeproduct launch eventfābùhuì发布会,expected toyùjì预计to launch / to introducetuīchū推出HomePad mini (Apple smart home display)HomePad miniHomePad miniand others / etc.děng等new-modelxīnkuǎn新款productschǎnpǐn产品。
Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products