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technology
kē jì
科技
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Huawei (tech company)
Huáwéi
华为
to announce / to release
fābù
发布
Tau (Greek letter τ)
Táo
陶
scaling / expansion
kuòzhǎn
扩展
physical law / principle
dìnglǜ
定律
,
to challenge
tiǎozhàn
挑战
Moore's Law
Mó'ěr Dìnglǜ
摩尔定律
。

Huawei (tech company)
Huáwéi
华为
at / in
zài
在
Shanghai
Shànghǎi
上海
to announce / to release
fābù
发布
Tau (Greek letter τ)
Táo
陶
scaling / expansion
kuòzhǎn
扩展
physical law / principle
dìnglǜ
定律
,
and / also
bìng
并
to introduce / to launch
tuīchū
推出
LogicFolding (chip architecture)
zhédié luójí
折叠逻辑
chip / microchip
xīnpiàn
芯片
architecture / framework
jiàgòu
架构
。

May 28, 2026 at 8:00 AM

five
5
5
month
yuè
月
twenty-five
25
25
day / date
rì
日
,
Huawei (tech company)
Huáwéi
华为
at / in
zài
在
Shanghai
Shànghǎi
上海
to hold (an event)
jǔxíng
举行
structural particle
de
的
IEEE (Institute of Electrical and Electronics Engineers)
IEEE
IEEE
international
guójì
国际
circuit
diànlù
电路
and
yǔ
与
system
xìtǒng
系统
symposium / conference
yántǎohuì
研讨会
at / on
shàng
上
to announce / to release
fābù
发布
completed action particle
le
了
Tau (τ) scaling
Táo
陶
scaling / expansion
kuòzhǎn
扩展
physical law / principle
dìnglǜ
定律
。
this / said (referring to previously mentioned)
gāi
该
law / principle
dìnglǜ
定律
using / by means of
yǐ
以
time
shíjiān
时间
dimension / axis
wéidù
维度
to replace / to substitute
tìdài
替代
geometric
jǐhé
几何
miniaturization / reduction in size
suōjiǎn
缩减
,
to put forward / to propose
tíchū
提出
chip / microchip
xīnpiàn
芯片
performance / capability
xìngnéng
性能
to improve / to enhance
tíshēng
提升
structural particle
de
的
new
xīn
新
path / approach
lùjìng
路径
。
Huawei (tech company)
Huáwéi
华为
at the same time / simultaneously
tóngshí
同时
to introduce / to launch
tuīchū
推出
LogicFolding (chip architecture)
zhédié luójí
折叠逻辑
architecture / framework
jiàgòu
架构
,
through / by means of
tōngguò
通过
multi-layer / multi-level
duōcéng
多层
collaborative / coordinated
xiétóng
协同
to optimize
yōuhuà
优化
to shorten / to reduce
suōduǎn
缩短
signal
xìnhào
信号
transmission / transfer
chuánshū
传输
path / distance
lùjìng
路径
。
this / this kind of
zhè yī
这一
design
shèjì
设计
not / no
bù
不
to rely on / to depend on
yīlài
依赖
expensive / costly
ángguì
昂贵
structural particle
de
的
lithography (chip manufacturing)
guānggè
光刻
process / technique
gōngyì
工艺
advancement / improvement
jìnbù
进步
,
but rather / instead
ér shì
而是
at / in
zài
在
system
xìtǒng
系统
level / dimension
céngmiàn
层面
to achieve / to realize
shíxiàn
实现
efficiency
xiàolǜ
效率
improvement / enhancement
tíshēng
提升
。
Huawei (tech company)
Huáwéi
华为
to state / to indicate
biǎoshì
表示
,
in the past / over the past
guòqù
过去
six years
liù nián
六年
within / during
jiān
间
already
yǐ
已
based on
jīyú
基于
Tau (τ) scaling
Táo
陶
scaling / expansion
kuòzhǎn
扩展
law / principle
dìnglǜ
定律
to design
shèjì
设计
and / also
bìng
并
to mass-produce
liàngchǎn
量产
completed action particle
le
了
381
381
381
types / models
kuǎn
款
chip / microchip
xīnpiàn
芯片
。
among them / of these
qízhōng
其中
,
this year
jīnnián
今年
autumn / fall season
qiūjì
秋季
to release / to launch
fābù
发布
structural particle
de
的
Kirin (Huawei chip series)
Qílín
麒麟
chip / microchip
xīnpiàn
芯片
will (future marker)
jiāng
将
to be the first to / to lead the way
shuàixiān
率先
to adopt / to use
cǎiyòng
采用
LogicFolding (chip architecture)
zhédié luójí
折叠逻辑
architecture / framework
jiàgòu
架构
。
to analyze / analysis
fēnxī
分析
analyst / person in the field
rénshì
人士
to point out / to note
zhǐchū
指出
,
the United States
Měiguó
美国
sanctions
zhìcái
制裁
to restrict / to limit
xiànzhì
限制
completed action particle
le
了
Huawei (tech company)
Huáwéi
华为
to obtain / to access
huòqǔ
获取
advanced
xiānjìn
先进
EUV lithography machine
guānggèjī
光刻机
structural particle
de
的
channel / means
tújìng
途径
,
this move / this action
cǐjǔ
此举
may be / could be
huò wéi
或为
to bypass / to work around
ràoguò
绕过
restrictions
xiànzhì
限制
structural particle
de
的
new
xīn
新
attempt / effort
chángshì
尝试
。

New Words

Huáwéi
华为
Huawei
xīnpiàn
芯片
chip
xìngnéng
性能
performance
dìnglǜ
定律
law
kuòzhǎn
扩展
scaling
jiàgòu
架构
architecture
guānggè
光刻
lithography
Qílín
麒麟
Kirin
zhìcái
制裁
sanctions
xiànzhì
限制
restrictions

News in English

Science & Technology

Huawei Unveils Tau Scaling Law to Challenge Moore's Law

Huawei unveiled its Tau Scaling Law and LogicFolding chip architecture in Shanghai, proposing a new path for semiconductor performance that does not rely solely on miniaturization.

On May 25, Huawei announced a new Tau scaling law at the IEEE International Circuit and System Research Symposium held in Shanghai. This law uses time dimension to replace geometric miniaturization, proposing a new approach for improving chip performance. Huawei simultaneously launched Logic Folding architecture, which optimizes signal transmission paths through multi-layer collaborative optimization, shortening signal transmission distances. This design does not rely on expensive lithography process advancement, but instead achieves efficiency improvement at the system level. Over the past six years, Huawei has designed and mass-produced 381 chip types based on the Tau scaling law. The Kirin chips launching this autumn will be the first to adopt Logic Folding architecture. Industry analysts note that United States sanctions have restricted Huawei's access to advanced EUV lithography machines, and this move may represent a new attempt to work around restrictions.

More in Science & Technology

Microsoft
Wēiruǎn
微软
to launch / to release
tuīchū
推出
Work IQ (Microsoft enterprise AI tool)
Work IQ
Work IQ
,
to let / to allow
ràng
让
Copilot (Microsoft AI assistant)
Copilot
Copilot
to connect to
liánjiē
连接
enterprise data
qǐyè shùjù
企业数据
。

Microsoft Launches Work IQ, Letting Copilot Connect to Enterprise Data

Nous Research (AI research company)
Nous Research
Nous Research
to complete
wánchéng
完成
$90 million
jiǔ qiān wàn měiyuán
九千万美元
to raise funding
róngzī
融资
,
Hermes (open-source AI model)
Hermes
Hermes
to advance into / to enter
jìnjūn
进军
enterprise market
qǐyè shìchǎng
企业市场
。

Nous Research Raises $90 Million, Hermes Enters Enterprise Market

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
,
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement