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technology
kē jì
科技
·HSK 4

Huawei (tech company)
Huáwéi
华为
to announce / to release
fābù
发布
Tau (Greek letter τ)
Táo
scaling / expansion
kuòzhǎn
扩展
physical law / principle
dìnglǜ
定律
to challenge
tiǎozhàn
挑战
Moore's Law
Mó'ěr Dìnglǜ
摩尔定律

Huawei (tech company)
Huáwéi
华为
at / in
zài
Shanghai
Shànghǎi
上海
to announce / to release
fābù
发布
Tau (Greek letter τ)
Táo
scaling / expansion
kuòzhǎn
扩展
physical law / principle
dìnglǜ
定律
and / also
bìng
to introduce / to launch
tuīchū
推出
LogicFolding (chip architecture)
zhédié luójí
折叠逻辑
chip / microchip
xīnpiàn
芯片
architecture / framework
jiàgòu
架构

May 28, 2026 at 8:00 AM

five
5
5
month
yuè
twenty-five
25
25
day / date
Huawei (tech company)
Huáwéi
华为
at / in
zài
Shanghai
Shànghǎi
上海
to hold (an event)
jǔxíng
举行
structural particle
de
IEEE (Institute of Electrical and Electronics Engineers)
IEEE
IEEE
international
guójì
国际
circuit
diànlù
电路
and
system
xìtǒng
系统
symposium / conference
yántǎohuì
研讨会
at / on
shàng
to announce / to release
fābù
发布
completed action particle
le
Tau (τ) scaling
Táo
scaling / expansion
kuòzhǎn
扩展
physical law / principle
dìnglǜ
定律
this / said (referring to previously mentioned)
gāi
law / principle
dìnglǜ
定律
using / by means of
time
shíjiān
时间
dimension / axis
wéidù
维度
to replace / to substitute
tìdài
替代
geometric
jǐhé
几何
miniaturization / reduction in size
suōjiǎn
缩减
to put forward / to propose
tíchū
提出
chip / microchip
xīnpiàn
芯片
performance / capability
xìngnéng
性能
to improve / to enhance
tíshēng
提升
structural particle
de
new
xīn
path / approach
lùjìng
路径
Huawei (tech company)
Huáwéi
华为
at the same time / simultaneously
tóngshí
同时
to introduce / to launch
tuīchū
推出
LogicFolding (chip architecture)
zhédié luójí
折叠逻辑
architecture / framework
jiàgòu
架构
through / by means of
tōngguò
通过
multi-layer / multi-level
duōcéng
多层
collaborative / coordinated
xiétóng
协同
to optimize
yōuhuà
优化
to shorten / to reduce
suōduǎn
缩短
signal
xìnhào
信号
transmission / transfer
chuánshū
传输
path / distance
lùjìng
路径
this / this kind of
zhè yī
这一
design
shèjì
设计
not / no
to rely on / to depend on
yīlài
依赖
expensive / costly
ángguì
昂贵
structural particle
de
lithography (chip manufacturing)
guānggè
光刻
process / technique
gōngyì
工艺
advancement / improvement
jìnbù
进步
but rather / instead
ér shì
而是
at / in
zài
system
xìtǒng
系统
level / dimension
céngmiàn
层面
to achieve / to realize
shíxiàn
实现
efficiency
xiàolǜ
效率
improvement / enhancement
tíshēng
提升
Huawei (tech company)
Huáwéi
华为
to state / to indicate
biǎoshì
表示
in the past / over the past
guòqù
过去
six years
liù nián
六年
within / during
jiān
already
based on
jīyú
基于
Tau (τ) scaling
Táo
scaling / expansion
kuòzhǎn
扩展
law / principle
dìnglǜ
定律
to design
shèjì
设计
and / also
bìng
to mass-produce
liàngchǎn
量产
completed action particle
le
381
381
381
types / models
kuǎn
chip / microchip
xīnpiàn
芯片
among them / of these
qízhōng
其中
this year
jīnnián
今年
autumn / fall season
qiūjì
秋季
to release / to launch
fābù
发布
structural particle
de
Kirin (Huawei chip series)
Qílín
麒麟
chip / microchip
xīnpiàn
芯片
will (future marker)
jiāng
to be the first to / to lead the way
shuàixiān
率先
to adopt / to use
cǎiyòng
采用
LogicFolding (chip architecture)
zhédié luójí
折叠逻辑
architecture / framework
jiàgòu
架构
to analyze / analysis
fēnxī
分析
analyst / person in the field
rénshì
人士
to point out / to note
zhǐchū
指出
the United States
Měiguó
美国
sanctions
zhìcái
制裁
to restrict / to limit
xiànzhì
限制
completed action particle
le
Huawei (tech company)
Huáwéi
华为
to obtain / to access
huòqǔ
获取
advanced
xiānjìn
先进
EUV lithography machine
guānggèjī
光刻机
structural particle
de
channel / means
tújìng
途径
this move / this action
cǐjǔ
此举
may be / could be
huò wéi
或为
to bypass / to work around
ràoguò
绕过
restrictions
xiànzhì
限制
structural particle
de
new
xīn
attempt / effort
chángshì
尝试

New Words

Huáwéi
华为
Huawei
xīnpiàn
芯片
chip
xìngnéng
性能
performance
dìnglǜ
定律
law
kuòzhǎn
扩展
scaling
jiàgòu
架构
architecture
guānggè
光刻
lithography
Qílín
麒麟
Kirin
zhìcái
制裁
sanctions
xiànzhì
限制
restrictions

News in English

Science & Technology

Huawei Unveils Tau Scaling Law to Challenge Moore's Law

Huawei unveiled its Tau Scaling Law and LogicFolding chip architecture in Shanghai, proposing a new path for semiconductor performance that does not rely solely on miniaturization.

On May 25, Huawei announced a new Tau scaling law at the IEEE International Circuit and System Research Symposium held in Shanghai. This law uses time dimension to replace geometric miniaturization, proposing a new approach for improving chip performance. Huawei simultaneously launched Logic Folding architecture, which optimizes signal transmission paths through multi-layer collaborative optimization, shortening signal transmission distances. This design does not rely on expensive lithography process advancement, but instead achieves efficiency improvement at the system level. Over the past six years, Huawei has designed and mass-produced 381 chip types based on the Tau scaling law. The Kirin chips launching this autumn will be the first to adopt Logic Folding architecture. Industry analysts note that United States sanctions have restricted Huawei's access to advanced EUV lithography machines, and this move may represent a new attempt to work around restrictions.

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China
Zhongguó
中国
AI
réngong zhìnéng
人工智能
models
móxíng
模型
captures
zhànlǐng
占领
market
shìchǎng
市场

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UBTech
Yōubìxuǎn
优必选
U1
U1
U1
humanoid robot
rénxíng jīqìrén
人形机器人
launches
fābuō
发布
price
jiàgé
价格

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Apple (company)
Píngguǒ
苹果
to file a lawsuit / to sue
qǐsù
起诉
OpenAI (AI company)
OpenAI
OpenAI
to accuse / to charge
zhǐkòng
指控
it / the company (formal)
to steal / to misappropriate
qièqǔ
窃取
hardware
yìngjiàn
硬件
trade secrets / confidential business information
shāngyè jīmì
商业机密

Apple Sues OpenAI Alleging Hardware Trade Secret Theft

Tencent (tech company)
Téngxùn
腾讯
in
zài
WeChat (messaging app)
Wēixìn
微信
to launch / roll out
tuīchū
推出
artificial intelligence
réngōng zhìnéng
人工智能
assistant
zhùshǒu
助手
Xiaowei (AI assistant name)
Xiǎowēi
小微

Tencent Begins Rolling Out AI Agent Xiaowei to WeChat Users