global / worldwidequánqiú全球semiconductorbàndǎotǐ半导体second quarter / Q2dì-èr jìdù第二季度sales revenuexiāoshòué销售额to set (a record)chuàng创all-time record highlìshǐ xīngāo历史新高。
global / worldwide
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
second quarter / Q2
dì-èr jìdù
第二季度
sales revenue
xiāoshòué
销售额
to set (a record)
chuàng
创
all-time record high
lìshǐ xīngāo
历史新高
according to
jù
据
industry association
hángyè xiéhuì
行业协会
report
bàogào
报告
the year 2026
2026 nián
2026年
second quarter / Q2
dì-èr jìdù
第二季度
global / worldwide
quánqiú
全球
chip / microchip
xīnpiàn
芯片
sales revenue
xiāoshòué
销售额
to reach / to achieve
dádào
达到
$403.3 billion USD
4033 yì měiyuán
4033亿美元
artificial intelligence / AI
réngōng zhìnéng
人工智能
demand
xūqiú
需求
is / to be
shì
是
main / primary
zhǔyào
主要
driving force
tuīdòng lì
推动力
August 13, 2026 at 10:00 AM
according to
jù
据
Semiconductor Industry Association
bàndǎotǐ hángyè xiéhuì
半导体行业协会
data / statistics
shùjù
数据
the year 2026
2026 nián
2026年
second quarter / Q2
dì-èr jìdù
第二季度
global / worldwide
quánqiú
全球
chip / microchip
xīnpiàn
芯片
sales revenue
xiāoshòué
销售额
to reach / to achieve
dádào
达到
$403.3 billion USD
4033 yì měiyuán
4033亿美元
to set (a record)
chuàng
创
history / historical
lìshǐ
历史
record
jìlù
纪录
this / this particular
zhè yī
这一
figure / number
shùzì
数字
compared to / than
bǐ
比
previous quarter
shàng yī jìdù
上一季度
to grow / to increase
zēngzhǎng
增长
(completion marker)
le
了
35.1 percent
35.1%
35.1%
to show / to demonstrate
xiǎnshì chū
显示出
market
shìchǎng
市场
demand / requirement
xūqiú
需求
(structural particle)
de
的
strong / robust
qiángjìng
强劲
momentum / trend
shìtou
势头
among them / in particular
qízhōng
其中
the month of June
6 yuèfèn
6月份
single month
dān yuè
单月
chip / microchip
xīnpiàn
芯片
sales revenue
xiāoshòué
销售额
year-on-year / compared to same period last year
tóngbǐ
同比
to grow / to increase
zēngzhǎng
增长
(completion marker)
le
了
123.6 percent
123.6%
123.6%
to set (a record)
chuàng xià
创下
in recent years
jìnnián lái
近年来
largest / biggest
zuìdà
最大
rate of increase
zhǎngfú
涨幅
one of
zhī yī
之一
artificial intelligence / AI
réngōng zhìnéng
人工智能
data center
shùjù zhōngxīn
数据中心
toward / for
duì
对
high-performance
gāo xìngnéng
高性能
chip / microchip
xīnpiàn
芯片
(structural particle)
de
的
large-scale
dà guīmó
大规模
demand / requirement
xūqiú
需求
to be considered / regarded as
bèi rènwéi
被认为
is / to be
shì
是
to drive / to promote
tuīdòng
推动
market
shìchǎng
市场
growth / to grow
zēngzhǎng
增长
(structural particle)
de
的
core / central
héxīn
核心
factor / element
yīnsù
因素
at the same time / meanwhile
yǔ cǐ tóngshí
与此同时
memory / RAM
nèicún
内存
chip / microchip
xīnpiàn
芯片
market
shìchǎng
市场
to continue / ongoing
chíxù
持续
supply falls short of demand
gōng bù yìng qiú
供不应求
some / a portion of
bùfen
部分
consumer electronics
xiāofèi diànzǐ
消费电子
product
chǎnpǐn
产品
to appear / to occur
chūxiàn
出现
(completion marker)
le
了
out of stock / shortage
quēhuò
缺货
(structural particle)
de
的
situation / condition
qíngkuàng
情况
analyst
fēnxīshī
分析师
to predict / forecast
yùcè
预测
by / until
dào
到
the year 2028
2028 nián
2028年
artificial intelligence (abbreviation)
AI
AI
data center
shùjù zhōngxīn
数据中心
chip / microchip
xīnpiàn
芯片
(structural particle)
de
的
annual revenue
nián shōurù
年收入
will / shall
jiāng
将
to exceed / to surpass
chāoguò
超过
$1.2 trillion USD
1.2 wàn yì měiyuán
1.2万亿美元
close to / approaching
jiējìn
接近
current / present
dāngqián
当前
level / standard
shuǐpíng
水平
(structural particle)
de
的
ten times / tenfold
shí bèi
十倍
facing / in the face of
miànduì
面对
rapid / fast
kuàisù
快速
growth / to grow
zēngzhǎng
增长
(structural particle)
de
的
market
shìchǎng
市场
various major
gè dà
各大
chip / microchip
xīnpiàn
芯片
manufacturer
zhìzàoshāng
制造商
currently / in the process of
zhèngzài
正在
actively / proactively
jījí
积极
to expand
kuòdà
扩大
production capacity
chǎnnéng
产能
and / also
bìng
并
to increase / to step up
jiādà
加大
R&D / research and development
yánfā
研发
investment / input
tóurù
投入
News in English
Science & TechnologyGlobal Semiconductor Sales Hit Record 403 Billion Dollars in Q2 2026
Worldwide chip sales reached a record $403.3 billion in Q2 2026, up 35.1 percent from the prior quarter, driven by surging AI data center demand.
More in Science & Technology
former / previousqián前Groq (AI chip startup)GroqGroqengineersgōngchéngshī工程师regarding / over (a matter)jiù就$20 billion USD200 yì měiyuán200亿美元Nvidia (US semiconductor company)Yīngwěidá英伟达licensing / authorizationshòuquán授权deal / transactionjiāoyì交易to file / to initiatetíqǐ提起a lawsuit / legal actionsùsòng诉讼。
former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal
Qualcomm (US semiconductor company)Gāotōng高通for the first timeshǒucì首次to / towardxiàng向Huawei (Chinese tech company)Huáwéi华为to pay / to make a paymentzhīfù支付patent royalties / licensing feezhuānlì fèi专利费,both partiesshuāngfāng双方to sign / to concludeqiānshǔ签署multi-year periodduō nián qī多年期agreement / dealxiéyì协议。
Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement
Tencent (Chinese tech company)Téngxùn腾讯from / towardxiàng向Oracle (US tech corporation)Jiǎgǔwén甲骨文to lease / to rent for usezūyòng租用one hundred thousandshí wàn十万measure word for small round objectskē颗artificial intelligenceréngōng zhìnéng人工智能semiconductor chip / microchipxīnpiàn芯片。
Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal
Apple Inc.Píngguǒ Gōngsī苹果公司to announcexuānbù宣布will (future marker)jiāng将on / at (preceding a date)yú于October 13thshíyuè shísān rì十月十三日to hold (an event)jǔxíng举行Welcome Home (name of Apple event)Welcome HomeWelcome Homeproduct launch eventfābùhuì发布会,expected toyùjì预计to launch / to introducetuīchū推出HomePad mini (Apple smart home display)HomePad miniHomePad miniand others / etc.děng等new-modelxīnkuǎn新款productschǎnpǐn产品。
Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products