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technology
kē jì
科技
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TSMC (Taiwan Semiconductor Manufacturing Company)
Tájīdiàn
台积电
to forecast / to predict
yùcè
预测
global / worldwide
quánqiú
全球
semiconductor chip
xīnpiàn
芯片
market
shìchǎng
市场
will / going to (future marker)
jiāng
将
by / at (time or place preposition)
yú
于
the year 2030
2030 nián
2030年
to break through / to surpass
tūpò
突破
$1.5 trillion USD
1.5 wànyì měiyuán
1.5万亿美元
。

TSMC (Taiwan Semiconductor Manufacturing Company)
Tájīdiàn
台积电
at / on (time preposition)
yú
于
May 14th
5 yuè 14 rì
5月14日
to release / to publish
fābù
发布
report / forecast
bàogào
报告
，
to forecast / to predict
yùcè
预测
artificial intelligence
réngōng zhìnéng
人工智能
will / going to (future marker)
jiāng
将
to drive / to propel
tuīdòng
推动
global / worldwide
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
market
shìchǎng
市场
scale / size
guīmó
规模
at / in (location/time)
zài
在
the year 2030
2030 nián
2030年
to exceed / to surpass
chāoguò
超过
$1.5 trillion USD
1.5 wànyì měiyuán
1.5万亿美元
。
this / the said (referring back)
gāi
该
forecast / prediction
yùcè
预测
compared to / relatively
jiào
较
previously / before this
cǐqián
此前
possessive / structural particle
de
的
$1 trillion USD
1 wànyì měiyuán
1万亿美元
target / goal
mùbiāo
目标
significantly / by a large margin
dàfú
大幅
to revise upward / to raise
shàngtiáo
上调
。

May 14, 2026 at 6:00 AM

TSMC (Taiwan Semiconductor Manufacturing Company)
Tájīdiàn
台积电
May 14th
5 yuè 14 rì
5月14日
to release / to publish
fābù
发布
latest / most recent
zuìxīn
最新
market
shìchǎng
市场
forecast / prediction
yùcè
预测
，
to estimate / to expect
yùjì
预计
global / worldwide
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
market
shìchǎng
市场
will (future marker)
jiāng
将
by / at
yú
于
the year 2030
2030 nián
2030年
to break through / to surpass
tūpò
突破
$1.5 trillion USD
1.5 wànyì měiyuán
1.5万亿美元
。
this / this particular
zhè yī
这一
figure / number
shùzì
数字
compared to / than
bǐ
比
previously / before this
cǐqián
此前
possessive / structural particle
de
的
forecast / prediction
yùcè
预测
exactly / a full amount
zhěngzhěng
整整
to be higher than / to exceed by
gāochū
高出
fifty percent
bǎifēnzhī wǔshí
50%
，
to reflect / to show
fǎnyìng
反映
completion particle
le
了
artificial intelligence
réngōng zhìnéng
人工智能
demand / need
xūqiú
需求
possessive / structural particle
de
的
rapid / fast
kuàisù
快速
growth / increase
zēngzhǎng
增长
。
TSMC
Tájīdiàn
台积电
to state / to indicate
biǎoshì
表示
，
artificial intelligence
réngōng zhìnéng
人工智能
and / with
yǔ
与
high-performance computing
gāo xìngnéng jìsuàn
高性能计算
will (future marker)
jiāng
将
to account for / to make up
zhàn
占
this / the said
gāi
该
market
shìchǎng
市场
possessive / structural particle
de
的
fifty-five percent
bǎifēnzhī wǔshíwǔ
55%
。
smartphone
zhìnéng shǒujī
智能手机
possessive / structural particle
de
的
market
shìchǎng
市场
market share / proportion
fèné
份额
on the other hand / then (contrast)
zé
则
expected to / estimated
yùjì
预计
to decline / to fall
xiàjiàng
下降
to / down to
zhì
至
twenty percent
bǎifēnzhī èrshí
20%
，
no longer / not anymore
bù zài
不再
to be (copula)
shì
是
chip / semiconductor
xīnpiàn
芯片
industry / sector
hángyè
行业
possessive / structural particle
de
的
main / primary
zhǔyào
主要
growth driver
zēngzhǎng
增长
engine / driver
yǐnqíng
引擎
。
in order to / for the purpose of
wèi
为
to meet / to satisfy
mǎnzú
满足
demand / need
xūqiú
需求
，
TSMC
Tájīdiàn
台积电
to plan / to schedule
jìhuà
计划
in / during
zài
在
the year 2026
2026 nián
2026年
to newly construct / to build
xīnjiàn
新建
nine phases / nine stages
jiǔ qī
九期
wafer / silicon wafer
jīngyuán
晶圆
factory / plant
chǎng
厂
and / as well as
jí
及
advanced / cutting-edge
xiānjìn
先进
packaging (chip packaging)
fēngzhuāng
封装
facility / installation
shèshī
设施
。
among them / of which
qízhōng
其中
most advanced / cutting-edge
zuì xiānjìn
最先进
possessive / structural particle
de
的
2-nanometer (chip process node)
2 nàmǐ
2纳米
chip
xīnpiàn
芯片
production capacity
chǎnnéng
产能
expected to
yùjì
预计
in / during
zài
在
from 2026 to 2028
2026 nián zhì 2028 nián
2026年至2028年
within / between (time period)
jiān
间
to achieve / to realize
shíxiàn
实现
seventy percent
bǎifēnzhī qīshí
70%
possessive / structural particle
de
的
compound annual growth rate (CAGR)
nián fùhé zēngzhǎnglǜ
年复合增长率
。
automotive / car
qìchē
汽车
chip / semiconductor
xīnpiàn
芯片
also / too
yě
也
passive marker (by / was done to)
bèi
被
to be regarded as / to be seen as
shì wéi
视为
important / significant
zhòngyào
重要
growth
zēngzhǎng
增长
field / area / sector
lǐngyù
领域
，
expected to
yùjì
预计
to account for
zhàn
占
overall / total
zhěngtǐ
整体
market
shìchǎng
市场
possessive / structural particle
de
的
ten percent
bǎifēnzhī shí
10%
。

New Words

Tájīdiàn
台积电
TSMC (Taiwan Semiconductor Manufacturing Company)
bàndǎotǐ
半导体
semiconductor
shìchǎng
市场
market
réngōng zhìnéng
人工智能
artificial intelligence
xīnpiàn
芯片
chip / semiconductor
jīngyuán
晶圆
wafer / silicon wafer
chǎnnéng
产能
production capacity
gāo xìngnéng jìsuàn
高性能计算
high-performance computing
fēngzhuāng
封装
packaging (chip packaging)
tūpò
突破
to break through
yùcè
预测
forecast / prediction
zēngzhǎng
增长
growth / increase

News in English

Science & Technology

TSMC Forecasts Global Semiconductor Market to Surpass $1.5 Trillion by 2030

TSMC released a forecast on May 14 predicting that AI will drive the global semiconductor market above $1.5 trillion by 2030. This significantly revises the company's previous $1 trillion target upward.

TSMC released its latest market forecast on May 14, indicating that the global semiconductor market is expected to break through $1.5 trillion USD by 2030. This figure is exactly 50% higher than previous forecasts, reflecting the rapid growth in artificial intelligence demand.

TSMC stated that artificial intelligence and high-performance computing will account for 55% of this market. Meanwhile, the smartphone market share is expected to decline to 20%, no longer being the primary growth engine for the chip industry.

To meet this demand, TSMC plans to build nine phases of wafer fabrication plants and advanced packaging facilities by 2026. The most advanced 2-nanometer chip production capacity is expected to achieve 70% compound annual growth rate between 2026 and 2028.

Automotive chips are also regarded as an important growth sector, expected to account for 10% of the overall market.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
，
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
，
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products