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technology
kē jì
科技
·HSK 5

TSMC (Taiwan Semiconductor Manufacturing Co.)
Táijīdiàn
台积电
to plan / to intend
jì huà
计划
from / starting from
zì
自
2027
2027 nián
2027年
starting / onwards
qǐ
起
will (future marker)
jiāng
将
contract chipmaking / chip foundry services
jīng yuán dài gōng
晶圆代工
price / prices
jià gé
价格
at most / up to
zuì gāo
最高
to raise / to increase
shàng tiáo
上调
10 percent
10%
10%
。

TSMC (Taiwan Semiconductor Manufacturing Co.)
Táijīdiàn
台积电
to plan / to intend
jì huà
计划
in / from (formal preposition)
yú
于
2027
2027 nián
2027年
for / regarding
duì
对
contract chipmaking services
jīng yuán dài gōng
晶圆代工
prices
jià gé
价格
to raise / to increase
shàng tiáo
上调
up to / at most
zuì gāo
最高
10 percent
10%
10%
,
covering / encompassing
hán gài
涵盖
advanced
xiān jìn
先进
and
yǔ
与
mature
chéng shú
成熟
the two major
liǎng dà
两大
process nodes / manufacturing processes
zhì chéng
制程
product lines
chǎn pǐn xiàn
产品线
。
this move / this decision
cǐ jǔ
此举
will
jiāng
将
for / regarding
duì
对
Apple
Píngguǒ
苹果
、
NVIDIA
Yīngwěidá
英伟达
and others / etc.
děng
等
major customers / clients
zhǔ yào kè hù
主要客户
(structural particle)
de
的
chips
xīn piàn
芯片
procurement costs
cǎi gòu chéng běn
采购成本
to have / to produce
chǎn shēng
产生
direct
zhí jiē
直接
impact / effect
yǐng xiǎng
影响
。

July 23, 2026 at 10:10 AM

according to
jù
据
Nikkei Asia (Japanese business newspaper)
Rìběn Jīngjì Xīnwén
日本经济新闻
to report / report
bào dào
报道
,
Taiwan Semiconductor Manufacturing Company
Táiwān Jītǐ Diànlù Zhìzào Gōngsī
台湾积体电路制造公司
to plan / to intend
jì huà
计划
from / starting from
zì
自
2027
2027 nián
2027年
starting / onwards
qǐ
起
will (future marker)
jiāng
将
contract chipmaking / foundry services
jīng yuán dài gōng
晶圆代工
prices
jià gé
价格
to raise / to increase
shàng tiáo
上调
up to / at most
zuì gāo
最高
10 percent
10%
10%
。
TSMC
Táijīdiàn
台积电
have already
yǐ
已
in / at (formal preposition)
yú
于
this year
jīn nián
今年
June
liù yuè
六月
to begin / to start
kāi shǐ
开始
with
yǔ
与
customers / clients
kè hù
客户
regarding / on the matter of
jiù
就
price adjustment
jià gé tiáo zhěng
价格调整
matters / affairs
shì yí
事宜
to conduct / to carry out
jìn xíng
进行
negotiations
tán pàn
谈判
,
target / scope
mù biāo
目标
to cover / to encompass
hán gài
涵盖
advanced process nodes
xiān jìn zhì chéng
先进制程
and
yǔ
与
mature process nodes
chéng shú zhì chéng
成熟制程
product lines
chǎn pǐn xiàn
产品线
。
among which / of this
qí zhōng
其中
,
12-nanometer
12 nà mǐ
12纳米
、
16-nanometer
16 nà mǐ
16纳米
and / as well as
jí
及
28-nanometer
28 nà mǐ
28纳米
etc. / and others
děng
等
mature process nodes
chéng shú zhì chéng
成熟制程
prices
jià gé
价格
rate of increase / magnitude of rise
zhǎng fú
涨幅
up to / at most
zuì gāo
最高
can reach / up to
kě dá
可达
10 percent
10%
10%
,
6-nanometer
6 nà mǐ
6纳米
and below / under
yǐ xià
以下
advanced process nodes
xiān jìn zhì chéng
先进制程
also / likewise (formal)
yì
亦
to face
miàn lín
面临
the same magnitude
tóng děng fú dù
同等幅度
(structural particle)
de
的
price adjustment
jià gé tiáo zhěng
价格调整
。
if / should (formal)
ruò
若
customers / clients
kè hù
客户
(structural particle)
de
的
high-performance computing
gāo xìng néng jì suàn
高性能计算
chips
xīn piàn
芯片
orders
dìng dān
订单
to exceed
chāo chū
超出
originally planned / originally specified
yuán dìng
原定
forecast volume
yù cè liàng
预测量
,
also must / additionally need to
hái xū
还须
additional / extra
é wài
额外
to pay
zhī fù
支付
10 to 15 percent
10% zhì 15%
10%至15%
(structural particle)
de
的
additional fees / surcharge
fù jiā fèi yòng
附加费用
。
TSMC
Táijīdiàn
台积电
the company stated / on the part of
fāng miàn
方面
to state / to indicate
biǎo shì
表示
,
this / this time
cǐ cì
此次
price increase
zhǎng jià
涨价
aimed at / intended to
zhǐ zài
旨在
to offset / to counterbalance
dǐ xiāo
抵消
raw materials
yuán cái liào
原材料
、
manufacturing equipment
zhì zào shè bèi
制造设备
and / as well as
jí
及
overseas factories
hǎi wài gōng chǎng
海外工厂
construction
jiàn shè
建设
costs
chéng běn
成本
(structural particle)
de
的
continuous / ongoing
chí xù
持续
increase / rise
shàng shēng
上升
。
analysts
fēn xī rén shì
分析人士
to believe / to consider
rèn wéi
认为
,
TSMC
Táijīdiàn
台积电
(structural particle)
de
的
pricing decisions
dìng jià jué cè
定价决策
will
jiāng
将
for / regarding
duì
对
Apple
Píngguǒ
苹果
、
NVIDIA
Yīngwěidá
英伟达
and others / etc.
děng
等
major customers
zhǔ yào kè hù
主要客户
(structural particle)
de
的
cost structure
chéng běn jié gòu
成本结构
to produce / to have
chǎn shēng
产生
significant / notable
xiǎn zhù
显著
impact / effect
yǐng xiǎng
影响
,
and furthermore
bìng
并
may / possibly
kě néng
可能
further
jìn yī bù
进一步
to push up / to drive up
tuī gāo
推高
consumer electronics
xiāo fèi diàn zǐ
消费电子
products
chǎn pǐn
产品
prices
jià gé
价格
。

News in English

Science & Technology

TSMC Plans to Raise Chipmaking Prices by up to 10 Percent From 2027

TSMC plans to raise chipmaking prices by up to 10 percent from 2027, covering both advanced and mature chip process lines. The change will directly impact procurement costs for major clients such as Apple and NVIDIA.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
,
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
,
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products