TSMC (Taiwan Semiconductor Manufacturing Co.)Táijīdiàn台积电to plan / to intendjì huà计划from / starting fromzì自20272027 nián2027年starting / onwardsqǐ起will (future marker)jiāng将contract chipmaking / chip foundry servicesjīng yuán dài gōng晶圆代工price / pricesjià gé价格at most / up tozuì gāo最高to raise / to increaseshàng tiáo上调10 percent10%10%。
TSMC (Taiwan Semiconductor Manufacturing Co.)
Táijīdiàn
台积电
to plan / to intend
jì huà
计划
from / starting from
zì
自
2027
2027 nián
2027年
starting / onwards
qǐ
起
will (future marker)
jiāng
将
contract chipmaking / chip foundry services
jīng yuán dài gōng
晶圆代工
price / prices
jià gé
价格
at most / up to
zuì gāo
最高
to raise / to increase
shàng tiáo
上调
10 percent
10%
10%
TSMC (Taiwan Semiconductor Manufacturing Co.)
Táijīdiàn
台积电
to plan / to intend
jì huà
计划
in / from (formal preposition)
yú
于
2027
2027 nián
2027年
for / regarding
duì
对
contract chipmaking services
jīng yuán dài gōng
晶圆代工
prices
jià gé
价格
to raise / to increase
shàng tiáo
上调
up to / at most
zuì gāo
最高
10 percent
10%
10%
covering / encompassing
hán gài
涵盖
advanced
xiān jìn
先进
and
yǔ
与
mature
chéng shú
成熟
the two major
liǎng dà
两大
process nodes / manufacturing processes
zhì chéng
制程
product lines
chǎn pǐn xiàn
产品线
this move / this decision
cǐ jǔ
此举
will
jiāng
将
for / regarding
duì
对
Apple
Píngguǒ
苹果
NVIDIA
Yīngwěidá
英伟达
and others / etc.
děng
等
major customers / clients
zhǔ yào kè hù
主要客户
(structural particle)
de
的
chips
xīn piàn
芯片
procurement costs
cǎi gòu chéng běn
采购成本
to have / to produce
chǎn shēng
产生
direct
zhí jiē
直接
impact / effect
yǐng xiǎng
影响
July 23, 2026 at 10:10 AM
according to
jù
据
Nikkei Asia (Japanese business newspaper)
Rìběn Jīngjì Xīnwén
日本经济新闻
to report / report
bào dào
报道
Taiwan Semiconductor Manufacturing Company
Táiwān Jītǐ Diànlù Zhìzào Gōngsī
台湾积体电路制造公司
to plan / to intend
jì huà
计划
from / starting from
zì
自
2027
2027 nián
2027年
starting / onwards
qǐ
起
will (future marker)
jiāng
将
contract chipmaking / foundry services
jīng yuán dài gōng
晶圆代工
prices
jià gé
价格
to raise / to increase
shàng tiáo
上调
up to / at most
zuì gāo
最高
10 percent
10%
10%
TSMC
Táijīdiàn
台积电
have already
yǐ
已
in / at (formal preposition)
yú
于
this year
jīn nián
今年
June
liù yuè
六月
to begin / to start
kāi shǐ
开始
with
yǔ
与
customers / clients
kè hù
客户
regarding / on the matter of
jiù
就
price adjustment
jià gé tiáo zhěng
价格调整
matters / affairs
shì yí
事宜
to conduct / to carry out
jìn xíng
进行
negotiations
tán pàn
谈判
target / scope
mù biāo
目标
to cover / to encompass
hán gài
涵盖
advanced process nodes
xiān jìn zhì chéng
先进制程
and
yǔ
与
mature process nodes
chéng shú zhì chéng
成熟制程
product lines
chǎn pǐn xiàn
产品线
among which / of this
qí zhōng
其中
12-nanometer
12 nà mǐ
12纳米
16-nanometer
16 nà mǐ
16纳米
and / as well as
jí
及
28-nanometer
28 nà mǐ
28纳米
etc. / and others
děng
等
mature process nodes
chéng shú zhì chéng
成熟制程
prices
jià gé
价格
rate of increase / magnitude of rise
zhǎng fú
涨幅
up to / at most
zuì gāo
最高
can reach / up to
kě dá
可达
10 percent
10%
10%
6-nanometer
6 nà mǐ
6纳米
and below / under
yǐ xià
以下
advanced process nodes
xiān jìn zhì chéng
先进制程
also / likewise (formal)
yì
亦
to face
miàn lín
面临
the same magnitude
tóng děng fú dù
同等幅度
(structural particle)
de
的
price adjustment
jià gé tiáo zhěng
价格调整
if / should (formal)
ruò
若
customers / clients
kè hù
客户
(structural particle)
de
的
high-performance computing
gāo xìng néng jì suàn
高性能计算
chips
xīn piàn
芯片
orders
dìng dān
订单
to exceed
chāo chū
超出
originally planned / originally specified
yuán dìng
原定
forecast volume
yù cè liàng
预测量
also must / additionally need to
hái xū
还须
additional / extra
é wài
额外
to pay
zhī fù
支付
10 to 15 percent
10% zhì 15%
10%至15%
(structural particle)
de
的
additional fees / surcharge
fù jiā fèi yòng
附加费用
TSMC
Táijīdiàn
台积电
the company stated / on the part of
fāng miàn
方面
to state / to indicate
biǎo shì
表示
this / this time
cǐ cì
此次
price increase
zhǎng jià
涨价
aimed at / intended to
zhǐ zài
旨在
to offset / to counterbalance
dǐ xiāo
抵消
raw materials
yuán cái liào
原材料
manufacturing equipment
zhì zào shè bèi
制造设备
and / as well as
jí
及
overseas factories
hǎi wài gōng chǎng
海外工厂
construction
jiàn shè
建设
costs
chéng běn
成本
(structural particle)
de
的
continuous / ongoing
chí xù
持续
increase / rise
shàng shēng
上升
analysts
fēn xī rén shì
分析人士
to believe / to consider
rèn wéi
认为
TSMC
Táijīdiàn
台积电
(structural particle)
de
的
pricing decisions
dìng jià jué cè
定价决策
will
jiāng
将
for / regarding
duì
对
Apple
Píngguǒ
苹果
NVIDIA
Yīngwěidá
英伟达
and others / etc.
děng
等
major customers
zhǔ yào kè hù
主要客户
(structural particle)
de
的
cost structure
chéng běn jié gòu
成本结构
to produce / to have
chǎn shēng
产生
significant / notable
xiǎn zhù
显著
impact / effect
yǐng xiǎng
影响
and furthermore
bìng
并
may / possibly
kě néng
可能
further
jìn yī bù
进一步
to push up / to drive up
tuī gāo
推高
consumer electronics
xiāo fèi diàn zǐ
消费电子
products
chǎn pǐn
产品
prices
jià gé
价格
News in English
Science & TechnologyTSMC Plans to Raise Chipmaking Prices by up to 10 Percent From 2027
TSMC plans to raise chipmaking prices by up to 10 percent from 2027, covering both advanced and mature chip process lines. The change will directly impact procurement costs for major clients such as Apple and NVIDIA.
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