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technology
kē jì
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·HSK 4

South Korea
Hánguó
韩国
government
zhèngfǔ
政府
artificial intelligence
rénggōng zhìnéng
人工智能
chip / semiconductor
xīnpiàn
芯片
earmarked / dedicated
zhuānxiàng
专项
budget
yùsuàn
预算
at / in
zài
在
August
bāyuè
八月
before / prior to
qián
前
still / yet
réng
仍
largely / a large amount of
dàliàng
大量
not yet / has not been
wèi bèi
未被
used / spent
shǐyòng
使用
。

according to
jù
据
reports
bàodào
报道
,
South Korea
Hánguó
韩国
government
zhèngfǔ
政府
for / in order to
wèi
为
to promote / to drive
tuīdòng
推动
domestic / homegrown
běntǔ
本土
artificial intelligence
rénggōng zhìnéng
人工智能
chip / semiconductor
xīnpiàn
芯片
R&D / research and development
yánfā
研发
and / but
ér
而
established / set up
shèlì de
设立的
earmarked / dedicated
zhuānxiàng
专项
budget
yùsuàn
预算
,
as of / up until
jiézhì
截至
this year
jīnnián
今年
August
bāyuè
八月
still
réng
仍
has / there are
yǒu
有
a large amount
dàliàng
大量
funds
zījīn
资金
not yet
wèi bèi
未被
used / deployed
dòngyòng
动用
。

October 5, 2026 at 2:00 PM

market research firm
shìchǎng yánjiū jīgòu
市场研究机构
DIGITIMES (tech news media)
DIGITIMES
DIGITIMES
on the 5th (of this month)
wǔ rì
5日
to publish / to release
fābù
发布
report
bàogào
报告
stating / noting
chēng
称
,
South Korea
Hánguó
韩国
government
zhèngfǔ
政府
structural particle
de
的
artificial intelligence
réngōng zhìnéng
人工智能
chip
xīnpiàn
芯片
development
kāifā
开发
earmarked / dedicated
zhuānxiàng
专项
budget
yùsuàn
预算
as of
jiézhì
截至
August
bāyuè
八月
still
réng
仍
largely / essentially
jīběn
基本
not yet
wèi bèi
未被
deployed / used
dòngyòng
动用
。
South Korea
Hánguó
韩国
government
zhèngfǔ
政府
previously
cǐqián
此前
promised / pledged
chéngnuò
承诺
to invest / to put in
tóurù
投入
a large amount of
dàliàng
大量
funds
zījīn
资金
to support
zhīchí
支持
domestic / homegrown
běntǔ
本土
AI (artificial intelligence)
AI
AI
chip
xīnpiàn
芯片
R&D
yánfā
研发
,
goal
mùbiāo
目标
is
shì
是
in
zài
在
AI (artificial intelligence)
AI
AI
semiconductor
bàndǎotǐ
半导体
field
lǐngyù
领域
to catch up with
zhuīgǎn
追赶
global
quánqiú
全球
the leaders / front-runners
lǐngxiān zhě
领先者
。
analyst
fēnxī rénshì
分析人士
pointed out / noted
zhǐchū
指出
,
budget
yùsuàn
预算
execution / implementation
zhíxíng
执行
slow / sluggish
chíhuǎn
迟缓
structural particle
de
的
reason / cause
yuányīn
原因
includes / including
bāokuò
包括
approval / review process
shěnpī
审批
procedures
chéngxù
程序
complicated / cumbersome
fánfù
繁复
and also / as well as
yǐjí
以及
qualified / eligible
hégé
合格
supplier / vendor
gōngyìngshāng
供应商
quantity / number
shùliàng
数量
insufficient / lacking
bùzú
不足
。
Samsung Electronics
Sānxīng Diànzǐ
三星电子
and
hé
和
SK Hynix
SK Hǎilìshì
SK海力士
although / while
suīrán
虽然
is / are
shì
是
globally
quánqiú
全球
leading
lǐngxiān de
领先的
memory chip
nèicún xīnpiàn
内存芯片
manufacturer
zhìzàoshāng
制造商
,
but / however
dàn
但
in
zài
在
AI (artificial intelligence)
AI
AI
logic chip
luójí xīnpiàn
逻辑芯片
field
lǐngyù
领域
still
réng
仍
behind / lags behind
luòhòu yú
落后于
Nvidia
Yīngwěidá
英伟达
。
expert
zhuānjiā
专家
stated / said
biǎoshì
表示
,
South Korea
Hánguó
韩国
if / should
ruò
若
not
bù
不
accelerate / speed up
jiākuài
加快
to advance / push forward
tuījìn
推进
relevant / related
xiāngguān
相关
R&D project
yánfā xiàngmù
研发项目
,
may / possibly
kěnéng
可能
in
zài
在
with
yǔ
与
United States
Měiguó
美国
、
China
Zhōngguó
中国
structural particle
de
的
AI chip
AI xīnpiàn
AI芯片
competition
jìngzhēng
竞争
in / among
zhōng
中
to be in (a position)
chǔyú
处于
unfavorable / disadvantaged
búlì
不利
position
wèizhì
位置
。
at the same time / meanwhile
yǔcǐ tóngshí
与此同时
,
South Korea
Hánguó
韩国
government
zhèngfǔ
政府
already
yǐ
已
proposed / put forward
tíchū
提出
fiscal year 2027
2027 niándù
2027年度
record-breaking
chuàng jìlù de
创纪录的
$530 billion
5300 yì měiyuán
5300亿美元
budget
yùsuàn
预算
,
to continue
jìxù
继续
to emphasize
qiángdiào
强调
will
jiāng
将
to increase / to step up
jiādà
加大
toward
duì
对
AI (artificial intelligence)
AI
AI
and
hé
和
chip
xīnpiàn
芯片
industry
chǎnyè
产业
structural particle
de
的
support
zhīchí
支持
。
criticism / critics
pīpíng
批评
individuals / voices
rénshì
人士
believe / argue
rènwéi
认为
,
relying solely on
jǐn kào
仅靠
increasing
zēngjiā
增加
budget
yùsuàn
预算
size / scale
guīmó
规模
cannot / does not
bìng bùnéng
并不能
solve / address
jiějué
解决
execution / implementation
zhíxíng
执行
efficiency
xiàolǜ
效率
low / poor
dīxià
低下
structural particle
de
的
fundamental / root
gēnběn
根本
problem
wèntí
问题
。
South Korea
Hánguó
韩国
government
zhèngfǔ
政府
officials
guānyuán
官员
stated
biǎoshì
表示
,
will
jiāng
将
to introduce / to roll out
chūtái
出台
new measures
xīn cuòshī
新措施
to accelerate
jiākuài
加快
funds
zījīn
资金
disbursement / allocation
bōfù
拨付
,
to ensure
quèbǎo
确保
budget
yùsuàn
预算
can / is able to
nénggòu
能够
effectively
yǒuxiào
有效
support
zhīchí
支持
AI (artificial intelligence)
AI
AI
technology
jìshù
技术
R&D / research and development
yánfā
研发
。

News in English

Science & Technology

South Korea AI Chip Development Budget Remains Largely Unspent Through August

South Korea government budget earmarked for domestic AI chip R&D remained largely unspent through August, raising questions about the efficiency of the country massive AI investment program.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
,
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
,
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products