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kē jì
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Japan
Rìběn
日本
three major
sān dà
三大
semiconductor
bàndǎotǐ
半导体
companies / enterprises
qǐyè
企业
to sign
qiānshǔ
签署
memorandum of understanding
yìxiàngshū
意向书
,
plans to / intends to
nǐ
拟
to integrate / to consolidate
zhěnghé
整合
power (electrical)
gōnglǜ
功率
chip / semiconductor
xīnpiàn
芯片
business / operations
yèwù
业务
。

ROHM (Japanese semiconductor company)
ROHM
ROHM
、
Toshiba
Dōngzhī
东芝
and
jí
及
Mitsubishi Electric
Sānlíng Diànjī
三菱电机
to sign
qiānshǔ
签署
memorandum of understanding
liàngjié bèiwànglù
谅解备忘录
,
formally
zhèngshì
正式
to initiate
qǐdòng
启动
three-party
sān fāng
三方
power semiconductor
gōnglǜ bàndǎotǐ
功率半导体
business
yèwù
业务
consolidation / integration
zhěnghé
整合
negotiations
tánpàn
谈判
,
merger
hébìng
合并
after
hòu
后
expected to
yǒuwàng
有望
to become
chéngwéi
成为
global
quánqiú
全球
second-largest
dì èr dà
第二大
power semiconductor
gōnglǜ bàndǎotǐ
功率半导体
supplier
gōngyìngshāng
供应商
。

March 28, 2026 at 12:00 PM

according to
jù
据
Nikkei Asia
Rìjīng Yàzhōu
日经亚洲
reports
bàodào
报道
,
ROHM (Japanese semiconductor company)
ROHM
ROHM
、
Toshiba
Dōngzhī
东芝
and
jí
及
Mitsubishi Electric
Sānlíng Diànjī
三菱电机
already / have
yǐ
已
to sign
qiānshǔ
签署
memorandum of understanding
liàngjié bèiwànglù
谅解备忘录
,
formally
zhèngshì
正式
to initiate / to launch
qǐdòng
启动
three-party
sān fāng
三方
power semiconductor
gōnglǜ bàndǎotǐ
功率半导体
business
yèwù
业务
consolidation / integration
zhěnghé
整合
negotiations
tánpàn
谈判
。
three-party / the three companies
sān fāng
三方
merger
hébìng
合并
after
hòu
后
,
the merged entity / combined company
hébìng shítǐ
合并实体
is expected to
yùjì
预计
will
jiāng
将
to hold / to occupy
zhànjù
占据
global
quánqiú
全球
power semiconductor
gōnglǜ bàndǎotǐ
功率半导体
market
shìchǎng
市场
approximately
yuē
约
10 percent
bǎifēnzhī shí
10%
to / through
zhì
至
11 percent
bǎifēnzhī shíyī
11%
structural particle
de
的
market share
fèné
份额
,
second only to
jǐn cì yú
仅次于
Germany
Déguó
德国
Infineon Technologies
Yīngfēilíng
英飞凌
,
to become
chéngwéi
成为
global
quánqiú
全球
second-largest
dì èr dà
第二大
supplier
gōngyìngshāng
供应商
。
this
cǐcì
此次
consolidation
zhěnghé
整合
driven by
yóu
由
each party
gè fāng
各方
differentiated
chāyìhuà
差异化
structural particle
de
的
technical / technology
jìshù
技术
strengths / advantages
yōushì
优势
driven / propelled
qūdòng
驱动
:
ROHM
ROHM
ROHM
specializes in / excels at
shàncháng
擅长
silicon carbide (SiC)
tànhuàguī
碳化硅
automotive
qìchē
汽车
semiconductors
bàndǎotǐ
半导体
,
Toshiba
Dōngzhī
东芝
possesses
yōngyǒu
拥有
extensive / wide-ranging
guǎngfàn
广泛
structural particle
de
的
industrial
gōngyè
工业
customer
kèhù
客户
network
wǎngluò
网络
,
Mitsubishi Electric
Sānlíng Diànjī
三菱电机
while / whereas
zé
则
deeply engaged in / focuses on
shēn gēng
深耕
high-voltage
gāoyā
高压
industrial
gōngyè
工业
equipment / devices
shèbèi
设备
field / sector
lǐngyù
领域
。
what is noteworthy is
zhídé guānzhù de shì
值得关注的是
,
the negotiations
tánpàn
谈判
structural particle
de
的
context / backdrop
bèijǐng
背景
is
shì
是
Japan
Rìběn
日本
automotive
qìchē
汽车
components / parts
líng bùjiàn
零部件
company
qǐyè
企业
Denso
Diànzhuāng
电装
company
gōngsī
公司
currently
zhèng
正
at / for
yǐ
以
approximately
yuē
约
$8.3 billion
bāshísān yì měiyuán
83亿美元
structural particle
de
的
price
jiàgé
价格
to bid for / to compete to acquire
jìnggòu
竞购
ROHM
ROHM
ROHM
,
three-party
sān fāng
三方
consolidation
zhěnghé
整合
may potentially
huò jiāng
或将
for / provide to
wèi
为
the latter
hòuzhě
后者
to provide
tígōng
提供
important
zhòngyào
重要
structural particle
de
的
strategic
zhànlüè
战略
option / alternative
xuǎnxiàng
选项
。
currently
mùqián
目前
the three parties
sān fāng
三方
have not yet
shàngwèi
尚未
regarding
jiù
就
specific / concrete
jùtǐ
具体
deal / transaction
jiāoyì
交易
structure / framework
jiàgòu
架构
to reach
dáchéng
达成
final
zuìzhōng
最终
decision
juédìng
决定
,
still / continuing to
réng zài
仍在
to carry out / to conduct
kāizhǎn
开展
in-depth / thorough
shēnrù
深入
structural particle
de
的
financial
cáiwù
财务
and
yǔ
与
legal
fǎlǜ
法律
assessment / evaluation
pínggū
评估
。
power semiconductors
gōnglǜ bàndǎotǐ
功率半导体
are
shì
是
electric vehicles
diàndòng qìchē
电动汽车
、
renewable energy
kě zàishēng néngyuán
可再生能源
and
jí
及
industrial
gōngyè
工业
automation
zìdònghuà
自动化
structural particle
de
的
core / key
héxīn
核心
component
yuánjiàn
元件
,
this
cǐcì
此次
consolidation
zhěnghé
整合
passive marker
bèi
被
the industry
yèjiè
业界
regarded as / seen as
shì wéi
视为
Japan
Rìběn
日本
to reshape / to reestablish
chóng sù
重塑
global
quánqiú
全球
competitiveness
jìngzhēnglì
竞争力
structural particle
de
的
strategic
zhànlüè
战略
move / measure
jǔcuò
举措
。
given / in light of
jiàn yú
鉴于
global
quánqiú
全球
supply chain
gōngyìng liàn
供应链
decentralization
qù zhōngxīnhuà
去中心化
trend
qūshì
趋势
continuing / sustained
chíxù
持续
to accelerate
jiāsù
加速
,
analysts
fēnxī rénshì
分析人士
argue / believe
rènwéi
认为
three-party
sān fāng
三方
consolidation
zhěnghé
整合
will
jiāng
将
contribute to / help
yǒu zhù yú
有助于
Japan
Rìběn
日本
companies
qǐyè
企业
to resist / to withstand
dǐyù
抵御
coming from
láizì
来自
China
Zhōngguó
中国
and
jí
及
Europe and America
Ōu Měi
欧美
peers / counterparts
tóngháng
同行
structural particle
de
的
competition
jìngzhēng
竞争
pressure
yālì
压力
。

New Words

gōnglǜ bàndǎotǐ
功率半导体
power semiconductor
zhànjù
占据
to occupy / hold
fèné
份额
market share
tánpàn
谈判
negotiations
jìngòu
竞购
to bid for
zhànlüè xuǎnxiàng
战略选项
strategic option
cáiwù pínggū
财务评估
financial evaluation
diàndòng qìchē
电动汽车
electric vehicle
kě zàishēng néngyuán
可再生能源
renewable energy
zìdònghuà
自动化
automation

News in English

Science & Technology

ROHM, Toshiba and Mitsubishi Electric Sign MOU to Merge Power Semiconductor Units

ROHM, Toshiba and Mitsubishi Electric have signed a memorandum of understanding to formally begin talks on merging their power semiconductor businesses, a combination that could create the second-largest power chip supplier in the world.

According to Nikkei Asia, ROHM, Toshiba, and Mitsubishi Electric have signed a memorandum of understanding to formally launch three-party power semiconductor business integration negotiations.

After the merger, the combined entity is projected to capture approximately 10-11% of the global power semiconductor market share, becoming the world's second-largest supplier, second only to Germany's Infineon Technologies.

The consolidation is driven by each party's differentiated technological advantages: ROHM excels at automotive silicon carbide semiconductors, Toshiba possesses extensive industrial customer networks, and Mitsubishi Electric specializes in high-voltage industrial equipment sectors.

Notably, the negotiation backdrop is that Japan's automotive parts company Denso is bidding for ROHM at approximately $8.3 billion, and the three-party consolidation may provide the latter an important strategic alternative.

Currently, the three parties have not yet reached final decisions on specific transaction structures and continue conducting thorough financial and legal evaluations.

Power semiconductors are core components for electric vehicles, renewable energy, and industrial automation. This consolidation is regarded by the industry as a strategic move for Japan to reshape its global competitiveness.

Given the accelerating decentralization trend in global supply chains, analysts believe three-party consolidation will help Japanese enterprises resist competitive pressure from counterparts in China and Europe and America.

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