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kē jì
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Japan
Rìběn
日本
three major
sān dà
三大
semiconductor
bàndǎotǐ
半导体
companies / enterprises
qǐyè
企业
to sign
qiānshǔ
签署
memorandum of understanding
yìxiàngshū
意向书
，
plans to / intends to
nǐ
拟
to integrate / to consolidate
zhěnghé
整合
power (electrical)
gōnglǜ
功率
chip / semiconductor
xīnpiàn
芯片
business / operations
yèwù
业务
。

ROHM (Japanese semiconductor company)
ROHM
ROHM
、
Toshiba
Dōngzhī
东芝
and
jí
及
Mitsubishi Electric
Sānlíng Diànjī
三菱电机
to sign
qiānshǔ
签署
memorandum of understanding
liàngjié bèiwànglù
谅解备忘录
，
formally
zhèngshì
正式
to initiate
qǐdòng
启动
three-party
sān fāng
三方
power semiconductor
gōnglǜ bàndǎotǐ
功率半导体
business
yèwù
业务
consolidation / integration
zhěnghé
整合
negotiations
tánpàn
谈判
，
merger
hébìng
合并
after
hòu
后
expected to
yǒuwàng
有望
to become
chéngwéi
成为
global
quánqiú
全球
second-largest
dì èr dà
第二大
power semiconductor
gōnglǜ bàndǎotǐ
功率半导体
supplier
gōngyìngshāng
供应商
。

March 28, 2026 at 12:00 PM

according to
jù
据
Nikkei Asia
Rìjīng Yàzhōu
日经亚洲
reports
bàodào
报道
，
ROHM (Japanese semiconductor company)
ROHM
ROHM
、
Toshiba
Dōngzhī
东芝
and
jí
及
Mitsubishi Electric
Sānlíng Diànjī
三菱电机
already / have
yǐ
已
to sign
qiānshǔ
签署
memorandum of understanding
liàngjié bèiwànglù
谅解备忘录
，
formally
zhèngshì
正式
to initiate / to launch
qǐdòng
启动
three-party
sān fāng
三方
power semiconductor
gōnglǜ bàndǎotǐ
功率半导体
business
yèwù
业务
consolidation / integration
zhěnghé
整合
negotiations
tánpàn
谈判
。
three-party / the three companies
sān fāng
三方
merger
hébìng
合并
after
hòu
后
，
the merged entity / combined company
hébìng shítǐ
合并实体
is expected to
yùjì
预计
will
jiāng
将
to hold / to occupy
zhànjù
占据
global
quánqiú
全球
power semiconductor
gōnglǜ bàndǎotǐ
功率半导体
market
shìchǎng
市场
approximately
yuē
约
10 percent
bǎifēnzhī shí
10%
to / through
zhì
至
11 percent
bǎifēnzhī shíyī
11%
structural particle
de
的
market share
fèné
份额
，
second only to
jǐn cì yú
仅次于
Germany
Déguó
德国
Infineon Technologies
Yīngfēilíng
英飞凌
，
to become
chéngwéi
成为
global
quánqiú
全球
second-largest
dì èr dà
第二大
supplier
gōngyìngshāng
供应商
。
this
cǐcì
此次
consolidation
zhěnghé
整合
driven by
yóu
由
each party
gè fāng
各方
differentiated
chāyìhuà
差异化
structural particle
de
的
technical / technology
jìshù
技术
strengths / advantages
yōushì
优势
driven / propelled
qūdòng
驱动
：
ROHM
ROHM
ROHM
specializes in / excels at
shàncháng
擅长
silicon carbide (SiC)
tànhuàguī
碳化硅
automotive
qìchē
汽车
semiconductors
bàndǎotǐ
半导体
，
Toshiba
Dōngzhī
东芝
possesses
yōngyǒu
拥有
extensive / wide-ranging
guǎngfàn
广泛
structural particle
de
的
industrial
gōngyè
工业
customer
kèhù
客户
network
wǎngluò
网络
，
Mitsubishi Electric
Sānlíng Diànjī
三菱电机
while / whereas
zé
则
deeply engaged in / focuses on
shēn gēng
深耕
high-voltage
gāoyā
高压
industrial
gōngyè
工业
equipment / devices
shèbèi
设备
field / sector
lǐngyù
领域
。
what is noteworthy is
zhídé guānzhù de shì
值得关注的是
，
the negotiations
tánpàn
谈判
structural particle
de
的
context / backdrop
bèijǐng
背景
is
shì
是
Japan
Rìběn
日本
automotive
qìchē
汽车
components / parts
líng bùjiàn
零部件
company
qǐyè
企业
Denso
Diànzhuāng
电装
company
gōngsī
公司
currently
zhèng
正
at / for
yǐ
以
approximately
yuē
约
$8.3 billion
bāshísān yì měiyuán
83亿美元
structural particle
de
的
price
jiàgé
价格
to bid for / to compete to acquire
jìnggòu
竞购
ROHM
ROHM
ROHM
，
three-party
sān fāng
三方
consolidation
zhěnghé
整合
may potentially
huò jiāng
或将
for / provide to
wèi
为
the latter
hòuzhě
后者
to provide
tígōng
提供
important
zhòngyào
重要
structural particle
de
的
strategic
zhànlüè
战略
option / alternative
xuǎnxiàng
选项
。
currently
mùqián
目前
the three parties
sān fāng
三方
have not yet
shàngwèi
尚未
regarding
jiù
就
specific / concrete
jùtǐ
具体
deal / transaction
jiāoyì
交易
structure / framework
jiàgòu
架构
to reach
dáchéng
达成
final
zuìzhōng
最终
decision
juédìng
决定
，
still / continuing to
réng zài
仍在
to carry out / to conduct
kāizhǎn
开展
in-depth / thorough
shēnrù
深入
structural particle
de
的
financial
cáiwù
财务
and
yǔ
与
legal
fǎlǜ
法律
assessment / evaluation
pínggū
评估
。
power semiconductors
gōnglǜ bàndǎotǐ
功率半导体
are
shì
是
electric vehicles
diàndòng qìchē
电动汽车
、
renewable energy
kě zàishēng néngyuán
可再生能源
and
jí
及
industrial
gōngyè
工业
automation
zìdònghuà
自动化
structural particle
de
的
core / key
héxīn
核心
component
yuánjiàn
元件
，
this
cǐcì
此次
consolidation
zhěnghé
整合
passive marker
bèi
被
the industry
yèjiè
业界
regarded as / seen as
shì wéi
视为
Japan
Rìběn
日本
to reshape / to reestablish
chóng sù
重塑
global
quánqiú
全球
competitiveness
jìngzhēnglì
竞争力
structural particle
de
的
strategic
zhànlüè
战略
move / measure
jǔcuò
举措
。
given / in light of
jiàn yú
鉴于
global
quánqiú
全球
supply chain
gōngyìng liàn
供应链
decentralization
qù zhōngxīnhuà
去中心化
trend
qūshì
趋势
continuing / sustained
chíxù
持续
to accelerate
jiāsù
加速
，
analysts
fēnxī rénshì
分析人士
argue / believe
rènwéi
认为
three-party
sān fāng
三方
consolidation
zhěnghé
整合
will
jiāng
将
contribute to / help
yǒu zhù yú
有助于
Japan
Rìběn
日本
companies
qǐyè
企业
to resist / to withstand
dǐyù
抵御
coming from
láizì
来自
China
Zhōngguó
中国
and
jí
及
Europe and America
Ōu Měi
欧美
peers / counterparts
tóngháng
同行
structural particle
de
的
competition
jìngzhēng
竞争
pressure
yālì
压力
。

News in English

Science & Technology

ROHM, Toshiba and Mitsubishi Electric Sign MOU to Merge Power Semiconductor Units

ROHM, Toshiba and Mitsubishi Electric have signed a memorandum of understanding to formally begin talks on merging their power semiconductor businesses, a combination that could create the second-largest power chip supplier in the world.

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