·HSK 4

Qualcomm (semiconductor company)
Gāotōng
高通
to announce
xuānbù
宣布
from / starting from
cóng
从
September 1
9 yuè 1 rì
9月1日
onwards / starting
qǐ
起
to raise / to increase
shàngtiáo
上调
Snapdragon (Qualcomm chip brand)
Xiāolóng
骁龙
chips / semiconductors
xīnpiàn
芯片
price
jiàgé
价格
，
Android (operating system)
Ānchuò
安卓
flagship
qíjiàn
旗舰
smartphone
shǒujī
手机
may / might (future possibility)
huò jiāng
或将
consequently / as a result
suí zhī
随之
to raise prices
zhǎngjià
涨价
。

Qualcomm (semiconductor company)

Gāotōng

高通

to announce

xuānbù

宣布

will (future marker)

jiāng

将

on / at (time)

yú

于

September 1

9 yuè 1 rì

9月1日

onwards / starting

qǐ

起

to raise / to increase

shàngtiáo

上调

Snapdragon (Qualcomm chip brand)

Xiāolóng

骁龙

chips / semiconductors

xīnpiàn

芯片

price

jiàgé

价格

，

rate of increase

zhǎngfú

涨幅

reaching / up to

dá

达

double digits

liǎng wèi shù

两位数

percentage

bǎifēnbǐ

百分比

，

reason / grounds

lǐyóu

理由

shì

是

supply chain

gōngyìng liàn

供应链

cost

chéngběn

成本

across-the-board / comprehensive

quánmiàn

全面

rising / increasing

shàngshēng

上升

。

because of / due to

yóuyú

由于

Snapdragon (Qualcomm chip brand)

Xiāolóng

骁龙

chips / semiconductors

xīnpiàn

芯片

widely / extensively

guǎngfàn

广泛

used in / applied to

yòng yú

用于

Android (operating system)

Ānchuò

安卓

flagship

qíjiàn

旗舰

smartphone

shǒujī

手机

，

consumers

xiāofèizhě

消费者

may / possibly

kěnéng

可能

in / during

zài

在

end of the year

niándǐ

年底

before

qián

前

to face / to be confronted with

miànlín

面临

smartphone

shǒujī

手机

price increase

zhǎngjià

涨价

(structural particle)

的

pressure

yālì

压力

。

August 6, 2026 at 8:40 AM

chip / semiconductor

xīnpiàn

芯片

giant / major player

jùtóu

巨头

Qualcomm (semiconductor company)

Gāotōng

高通

to announce

xuānbù

宣布

，

will (future marker)

jiāng

将

on / at (time)

yú

于

September 1

9 yuè 1 rì

9月1日

onwards / starting

qǐ

起

for / toward

duì

对

owned by / under

qíxià

旗下

Snapdragon (Qualcomm chip brand)

Xiāolóng

骁龙

series / lineup

xìliè

系列

chips / semiconductors

xīnpiàn

芯片

to implement / to carry out

shíshī

实施

double-digit

liǎng wèi shù

两位数

percentage

bǎifēnbǐ

百分比

(possessive particle)

的

price

jiàgé

价格

increase / raise

shàngtiáo

上调

。

Qualcomm (semiconductor company)

Gāotōng

高通

Chief Executive Officer (CEO)

shǒuxí zhíxíngguān

首席执行官

Cristiano Amon (Qualcomm CEO)

Kèlǐsīdìyǎnuò Āméng

克里斯蒂亚诺·阿蒙

in / at

zài

在

July 29

7 yuè 29 rì

7月29日

(possessive particle)

的

quarterly

jìdù

季度

earnings / results

yèjì

业绩

at the meeting

huì shàng

会上

to state / to indicate

biǎoshì

表示

，

cost

chéngběn

成本

has risen

zhǎng le

涨了

，

price

jiàgé

价格

also

yě

也

must / needs to

yào

要

to follow / accordingly

gēnzhe

跟着

to rise / to increase

zhǎng

涨

。

price

jiàgé

价格

rising / increase

shàngzhǎng

上涨

(possessive particle)

的

main / primary

zhǔyào

主要

reason / cause

yuányīn

原因

shì

是

TSMC (Taiwan Semiconductor Manufacturing Company)

Táijīdiàn

台积电

and others / etc.

děng

等

contract manufacturer / fab

dàigōng chǎng

代工厂

to raise / to increase

tígāo

提高

(completed action particle)

了

wafer

jīngyuán

晶圆

manufacturing / production

zhìzào

制造

、

packaging (semiconductors)

fēngzhuāng

封装

and

hé

和

testing

cèshì

测试

(possessive particle)

的

costs / fees

fèiyòng

费用

。

memory / storage

nèicún

内存

and

hé

和

components / parts

líng bùjiàn

零部件

supply

gōngyìng

供应

tight / constrained

jǐnzhāng

紧张

to lead to / to cause

dǎozhì

导致

Qualcomm (semiconductor company)

Gāotōng

高通

(possessive particle)

的

raw materials

yuáncáiliào

原材料

cost

chéngběn

成本

to experience / to see

chūxiàn

出现

across-the-board / comprehensive

quánmiàn

全面

increase / rise

shàngshēng

上升

。

new model / latest

xīn kuǎn

新款

flagship

qíjiàn

旗舰

chip / semiconductor

xīnpiàn

芯片

Snapdragon 8 Elite Gen 6 Pro (Qualcomm flagship chip)

Snapdragon 8 Elite Gen 6 Pro

骁龙8 Elite Gen 6 Pro

(possessive particle)

的

supply price / wholesale price

gōnghuòjià

供货价

to expect / estimated

yùjì

预计

will

jiāng

将

to exceed / to surpass

chāoguò

超过

$300

sān bǎi Měiyuán

三百美元

，

higher than

gāo yú

高于

current model

xiànkuǎn

现款

approximately

yuē

约

$280

liǎng bǎi bāshí Měiyuán

两百八十美元

(possessive particle)

的

level

shuǐpíng

水平

。

Samsung (electronics company)

Sāmxīng

三星

and

hé

和

OnePlus (smartphone brand)

Yī Jiā

一加

and others / etc.

děng

等

major / primary

zhǔyào

主要

Android

Ānchuò

安卓

smartphone

shǒujī

手机

brand

pǐnpái

品牌

all / both

jūn

均

to use

shǐyòng

使用

Snapdragon

Xiāolóng

骁龙

chips

xīnpiàn

芯片

，

this

cǐcì

此次

price increase

zhǎngjià

涨价

is expected to

yùjì

预计

will

jiāng

将

to push up / to drive up

tuī gāo

推高

end of 2026

2026 nián dǐ

2026年底

to / through

zhì

至

2027

2027 nián

2027年

(possessive particle)

的

smartphone

shǒujī

手机

price

jiàgé

价格

。

market

shìchǎng

市场

analyst

fēnxī shī

分析师

to believe / to consider

rènwéi

认为

，

as / with (progression)

suízhe

随着

artificial intelligence

réngōng zhìnéng

人工智能

computing power

suànlì

算力

demand

xūqiú

需求

continuing / sustained

chíxù

持续

growth

zēngzhǎng

增长

，

semiconductor

bàndǎotǐ

半导体

supply chain

gōngyìng liàn

供应链

cost

chéngběn

成本

pressure

yālì

压力

in the short term

duǎnqī nèi

短期内

difficult to / hard to

nányǐ

难以

to ease / to relieve

huǎnjiě

缓解

。

News in English

Science & Technology

Qualcomm to Raise Snapdragon Chip Prices From September 1 as Android Phone Costs Set to Rise

Qualcomm announced double-digit percentage price increases for Snapdragon chips effective September 1, citing across-the-board supply chain cost increases. Because Snapdragon chips are widely used in flagship Android phones, consumers may face higher phone prices before year-end.

News in English

Qualcomm to Raise Snapdragon Chip Prices From September 1 as Android Phone Costs Set to Rise

More in Science & Technology