OpenAI (AI company)OpenAIOpenAIand / together withyǔ与Broadcom (semiconductor company)Bótōng博通jointly / togetherliánhé联合to release / to unveilfābù发布first / debut modelshǒukuǎn首款self-developed / proprietaryzìyán自研AI (artificial intelligence)AIAIchip / microchipxīnpiàn芯片Jalapeño (chip name)JalapeñoJalapeño。
OpenAI (AI company)
OpenAI
OpenAI
and / together with
yǔ
与
Broadcom (semiconductor company)
Bótōng
博通
jointly / together
liánhé
联合
to release / to unveil
fābù
发布
first / debut model
shǒukuǎn
首款
self-developed / proprietary
zìyán
自研
AI (artificial intelligence)
AI
AI
chip / microchip
xīnpiàn
芯片
Jalapeño (chip name)
Jalapeño
Jalapeño
OpenAI (AI company)
OpenAI
OpenAI
and / together with
yǔ
与
Broadcom (semiconductor company)
Bótōng
博通
on / at (date/place marker)
yú
于
June 24
6 yuè 24 rì
6月24日
to release / to announce
fābù
发布
first / debut
shǒukuǎn
首款
self-developed / proprietary
zìyán
自研
AI (artificial intelligence)
AI
AI
inference / reasoning
tuīlǐ
推理
chip / processor
xīnpiàn
芯片
Jalapeño (chip name)
Jalapeño
Jalapeño
this chip / the said chip
gāi xīnpiàn
该芯片
specifically designed for
zhuānwèi
专为
large language model / LLM
dà yǔyán móxíng
大语言模型
inference
tuīlǐ
推理
to optimize / optimized
yōuhuà
优化
cost
chéngběn
成本
compared to / relatively
jiào
较
existing / current
xiànyǒu
现有
GPU (graphics processing unit)
GPU
GPU
to reduce / to lower
jiàngdī
降低
approximately / about
yuē
约
50 percent
50%
50%
June 28, 2026 at 2:00 AM
OpenAI (AI company)
OpenAI
OpenAI
and / together with
yǔ
与
Broadcom (semiconductor company)
Bótōng
博通
on / at (date/place marker)
yú
于
June 24
6 yuè 24 rì
6月24日
jointly
liánhé
联合
to release / to announce
fābù
发布
first / debut
shǒukuǎn
首款
self-developed / proprietary
zìyán
自研
AI (artificial intelligence)
AI
AI
inference
tuīlǐ
推理
chip
xīnpiàn
芯片
Jalapeño (chip name)
Jalapeño
Jalapeño
this chip / the said chip
gāi xīnpiàn
该芯片
from
cóng
从
design
shèjì
设计
to / until
dào
到
tape-out / chip manufacturing
liúpiàn
流片
took only
jǐn yòng
仅用
nine months
jiǔ gè yuè
九个月
is considered to be
bèi rènwéi
被认为
is / to be
shì
是
high-performance
gāo xìngnéng
高性能
semiconductor
bàndǎotǐ
半导体
field / domain
lǐngyù
领域
the fastest
zuì kuài
最快
(structural particle)
de
的
chip
xīnpiàn
芯片
development
kāifā
开发
cycle / period
zhōuqī
周期
Jalapeño (chip name)
Jalapeño
Jalapeño
specifically designed for
zhuānwèi
专为
large language model / LLM
dà yǔyán móxíng
大语言模型
inference
tuīlǐ
推理
and / while (connective)
ér
而
designed
shèjì
设计
in / at
zài
在
memory
nèicún
内存
movement / transfer
yídòng
移动
networking
wǎngluò
网络
and
hé
和
serving / service
fúwù
服务
and so on / etc.
děng
等
aspects / areas
fāngmiàn
方面
carried out / performed
jìnxíngle
进行了
deep / in-depth
shēndù
深度
optimization
yōuhuà
优化
early-stage / initial
zǎoqī
早期
testing / tests
cèshì
测试
show / indicate
xiǎnshì
显示
Jalapeño (chip name)
Jalapeño
Jalapeño
(structural particle)
de
的
per watt
měi wǎ
每瓦
performance
xìngnéng
性能
far exceeds / surpasses by a wide margin
yuǎn chāo
远超
existing / current
xiànyǒu
现有
state-of-the-art / most advanced
zuì xiānjìn
最先进
(structural particle)
de
的
level / standard
shuǐpíng
水平
compared to / with
yǔ
与
typical / standard
diǎnxíng
典型
AI (artificial intelligence)
AI
AI
GPU (graphics processing unit)
GPU
GPU
in comparison / compared with
xiāngbǐ
相比
this chip
gāi xīnpiàn
该芯片
can / is able to
kě
可
to save / to reduce
jiéshěng
节省
approximately
yuē
约
50 percent
50%
50%
(structural particle)
de
的
cost
chéngběn
成本
the two companies
liǎng jiā
两家
company
gōngsī
公司
plan / intend
jìhuà
计划
by / at (time marker)
yú
于
end of 2026
2026 nián dǐ
2026年底
before / prior to
qián
前
to complete / to finish
wánchéng
完成
first batch / initial deployment
shǒupī
首批
Jalapeño (chip name)
Jalapeño
Jalapeño
chips
xīnpiàn
芯片
(structural particle)
de
的
deployment / rollout
bùshǔ
部署
this move / this action
cǐ jǔ
此举
makes / causes
shǐ
使
OpenAI (AI company)
OpenAI
OpenAI
to join / to be among
jiārù
加入
Google
Gǔgē
谷歌
Apple
Píngguǒ
苹果
and others / etc.
děng
等
self-developed
zìyán
自研
AI
AI
AI
chips
xīnpiàn
芯片
(structural particle)
de
的
technology
kējì
科技
giants / major players
jùtóu
巨头
ranks / group
hángliè
行列
News in English
Science & TechnologyOpenAI and Broadcom Unveil First Proprietary AI Inference Chip Jalapeno
OpenAI and Broadcom unveiled Jalapeno on June 24, a proprietary AI inference chip optimized for large language models, with costs roughly 50 percent lower than current GPUs.
More in Science & Technology
former / previousqián前Groq (AI chip startup)GroqGroqengineersgōngchéngshī工程师regarding / over (a matter)jiù就$20 billion USD200 yì měiyuán200亿美元Nvidia (US semiconductor company)Yīngwěidá英伟达licensing / authorizationshòuquán授权deal / transactionjiāoyì交易to file / to initiatetíqǐ提起a lawsuit / legal actionsùsòng诉讼。
former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal
Qualcomm (US semiconductor company)Gāotōng高通for the first timeshǒucì首次to / towardxiàng向Huawei (Chinese tech company)Huáwéi华为to pay / to make a paymentzhīfù支付patent royalties / licensing feezhuānlì fèi专利费,both partiesshuāngfāng双方to sign / to concludeqiānshǔ签署multi-year periodduō nián qī多年期agreement / dealxiéyì协议。
Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement
Tencent (Chinese tech company)Téngxùn腾讯from / towardxiàng向Oracle (US tech corporation)Jiǎgǔwén甲骨文to lease / to rent for usezūyòng租用one hundred thousandshí wàn十万measure word for small round objectskē颗artificial intelligenceréngōng zhìnéng人工智能semiconductor chip / microchipxīnpiàn芯片。
Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal
Apple Inc.Píngguǒ Gōngsī苹果公司to announcexuānbù宣布will (future marker)jiāng将on / at (preceding a date)yú于October 13thshíyuè shísān rì十月十三日to hold (an event)jǔxíng举行Welcome Home (name of Apple event)Welcome HomeWelcome Homeproduct launch eventfābùhuì发布会,expected toyùjì预计to launch / to introducetuīchū推出HomePad mini (Apple smart home display)HomePad miniHomePad miniand others / etc.děng等new-modelxīnkuǎn新款productschǎnpǐn产品。
Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products