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NVIDIA (semiconductor company)
Yīngwěidá
英伟达
at
zài
在
GTC 2026 (NVIDIA annual AI conference)
GTC 2026
GTC 2026
conference / convention
dàhuì
大会
to launch / release
tuīchū
推出
Vera Rubin (NVIDIA AI GPU platform)
Vera Rubin
Vera Rubin
platform
píngtái
平台
,
strategic focus
zhànlüè zhōngxīn
战略重心
shifting toward
zhuǎnxiàng
转向
AI (artificial intelligence)
AI
AI
inference
tuīlǐ
推理
。

NVIDIA
Yīngwěidá
英伟达
at
zài
在
GTC 2026 (NVIDIA annual AI conference)
GTC 2026
GTC 2026
annual conference
niándù dàhuì
年度大会
at (location particle)
shàng
上
launched
tuīchū le
推出了
Vera Rubin (NVIDIA AI GPU platform)
Vera Rubin
Vera Rubin
GPU (graphics processing unit)
GPU
GPU
platform
píngtái
平台
,
positioning it
jiāng qí
将其
to position as
dìngwèi wéi
定位为
next-generation
xīn yī dài
新一代
agentic
dàilǐ shì
代理式
artificial intelligence
réngōng zhìnéng
人工智能
inference
tuīlǐ
推理
structural particle
de
的
core
héxīn
核心
infrastructure
jīchǔ shèshī
基础设施
。
the company
gōngsī
公司
also
hái
还
revealed / disclosed
pīlù le
披露了
expected to
yùjì
预计
in
yú
于
2028
2028 nián
2028年
to be launched
tuīchū de
推出的
next-generation
xià yī dài
下一代
Feynman (NVIDIA next-gen GPU architecture)
Feynman
Feynman
architecture
jiàgòu
架构
,
this / the aforementioned
gāi
该
architecture
jiàgòu
架构
will
jiāng
将
for the first time
shǒucì
首次
to adopt / to use
cǎiyòng
采用
3D / three-dimensional
sān wéi
三维
chip stacking
xīnpiàn duīdié
芯片堆叠
technology
jìshù
技术
and / as well as
jí
及
TSMC (Taiwan Semiconductor Manufacturing Company)
Táijīdiàn
台积电
1.6 nanometer (A16 process node)
1.6 nàmǐ
1.6纳米
process technology
zhìchéng
制程
。

March 18, 2026 at 2:00 PM

mid-March
sān yuè zhōngxún
三月中旬
,
NVIDIA (semiconductor company)
Yīngwěidá
英伟达
at
zài
在
GTC 2026 (NVIDIA annual AI conference)
GTC 2026
GTC 2026
annual conference
niándù dàhuì
年度大会
at (location particle)
shàng
上
officially / formally
zhèngshì
正式
launched / released
fābù le
发布了
next-generation
xīn yī dài
新一代
Vera Rubin (NVIDIA AI GPU platform)
Vera Rubin
Vera Rubin
GPU (graphics processing unit)
GPU
GPU
platform
píngtái
平台
。
this / the aforementioned
gāi
该
platform
píngtái
平台
in the form of
yǐ
以
rack scale
jī jià guīmó
机架规模
supercomputer
chāojí jìsuànjī
超级计算机
structural particle
de
的
form / configuration
xíngtài
形态
,
integrating (preposition)
jiāng
将
self-developed / in-house
zì yán
自研
Vera CPU (NVIDIA processor)
Vera CPU
Vera CPU
and / with
yǔ
与
Rubin GPU (NVIDIA GPU architecture)
Rubin GPU
Rubin GPU
architecture
jiàgòu
架构
deeply integrated
shēndù jíchéng
深度集成
。
NVIDIA
Yīngwěidá
英伟达
CEO / chief executive officer
shǒuxí zhíxíngguān
首席执行官
Jensen Huang (NVIDIA CEO)
Huáng Rénxūn
黄仁勋
stated / said
biǎoshì
表示
,
this
zhè yī
这一
platform
píngtái
平台
specifically for
zhuān wèi
专为
large-scale
dà guīmó
大规模
agentic
dàilǐ shì
代理式
AI (artificial intelligence)
AI
AI
inference
tuīlǐ
推理
tasks / workloads
rènwù
任务
designed
shèjì
设计
,
inference
tuīlǐ
推理
performance
xìngnéng
性能
compared to
jiào
较
previous generation
shàng yī dài
上一代
to improve / increase
tíshēng
提升
several times over
shù bèi
数倍
。
this
cǐ cì
此次
conference
dàhuì
大会
also / at the same time
tóngshí
同时
to send out / to signal
shìfàng chū
释放出
the company
gōngsī
公司
strategic transformation / pivot
zhànlüè zhuǎnxíng
战略转型
signal
xìnhào
信号
,
NVIDIA
Yīngwěidá
英伟达
clearly / explicitly
míngquè
明确
will
jiāng
将
business focus
yèwù zhōngxīn
业务重心
from
cóng
从
AI
AI
AI
training
xùnliàn
训练
toward / shifting to
zhuǎnxiàng
转向
large-scale
dà guīmó
大规模
inference
tuīlǐ
推理
and
yǔ
与
agentic
dàilǐ
代理
workflows
gōngzuò liú
工作流
。
in terms of
zài
在
hardware
yìngjiàn
硬件
roadmap
lùxiàntú
路线图
aspect / in terms of
fāngmiàn
方面
,
NVIDIA
Yīngwěidá
英伟达
revealed / disclosed
pīlù le
披露了
next-generation
xià yī dài
下一代
Feynman (NVIDIA next-gen GPU architecture)
Feynman
Feynman
GPU (graphics processing unit)
GPU
GPU
architecture
jiàgòu
架构
,
expected to
yùjì
预计
in
yú
于
2028
2028 nián
2028年
to launch / release
tuīchū
推出
。
Feynman (GPU architecture)
Feynman
Feynman
will
jiāng
将
to adopt / to use
cǎiyòng
采用
3D / three-dimensional
sān wéi
三维
chip stacking
xīnpiàn duīdié
芯片堆叠
design
shèjì
设计
,
process technology
zhìchéng gōngyì
制程工艺
upgraded to
shēngjí zhì
升级至
TSMC (Taiwan Semiconductor Manufacturing Company)
Táijīdiàn
台积电
1.6 nanometer (A16 process node)
1.6 nàmǐ
1.6纳米
,
is
shì
是
NVIDIA
Yīngwěidá
英伟达
the first / inaugural model
shǒu kuǎn
首款
sub-1-nanometer class
1 nàmǐ jí
1纳米级
product
chǎnpǐn
产品
。
analysts
fēnxī rénshì
分析人士
believe / consider
rènwéi
认为
,
this
cǐ cì
此次
launch / announcement
fābù
发布
further / additionally
jìn yī bù
进一步
consolidated / reinforced
gǒnggù le
巩固了
NVIDIA
Yīngwěidá
英伟达
in
zài
在
artificial intelligence
réngōng zhìnéng
人工智能
infrastructure
jīchǔ shèshī
基础设施
market
shìchǎng
市场
structural particle
de
的
leading position / dominance
lǐngdǎo dìwèi
领导地位
。

New Words

Yīngwěidá
英伟达
NVIDIA
GPU
GPU
graphics processing unit
píngtái
平台
platform
tuīlǐ
推理
inference
jiàgòu
架构
architecture
xìngnéng
性能
performance
zhànlüè zhuǎnxíng
战略转型
strategic transformation
xīnpiàn duīdié
芯片堆叠
chip stacking
zhìchéng gōngyì
制程工艺
process technology
lǐngdǎo dìwèi
领导地位
leading position

News in English

Science & Technology

NVIDIA Unveils Vera Rubin Platform at GTC 2026, Shifting Focus to AI Inference

NVIDIA unveiled the Vera Rubin GPU platform at GTC 2026, positioning it as the core infrastructure for next-generation agentic AI inference. The company also revealed the Feynman architecture roadmap for 2028, which will feature 3D chip stacking and TSMC A16 process technology.

In mid-March, NVIDIA officially launched the next-generation Vera Rubin GPU platform at the GTC 2026 annual conference.

This platform takes the form of a rack-scale supercomputer, deeply integrating the self-developed Vera CPU with the Rubin GPU architecture.

NVIDIA CEO Jensen Huang stated that this platform is specifically designed for large-scale agentic AI inference tasks. Inference performance has improved several times over compared to the previous generation.

The conference also released signals of the company's strategic transformation. NVIDIA clearly indicated that it will shift its business focus from AI training toward large-scale inference and agentic workflows.

Regarding the hardware roadmap, NVIDIA disclosed the next-generation Feynman GPU architecture, expected to be launched in 2028. Feynman will adopt 3D chip stacking design, with the process technology upgraded to TSMC's 1.6 nanometer, marking NVIDIA's first sub-1-nanometer class product.

Analysts believe that this launch further consolidated NVIDIA's leading position in the artificial intelligence infrastructure market.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
,
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
,
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products