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technology
kē jì
科技
·HSK 5

Intel (semiconductor company)
Yīngtèěr
英特尔
to become
chéngwéi
成为
globally / worldwide
quánqiú
全球
the first company
shǒujiā
首家
to use / to employ
shǐyòng
使用
high numerical aperture (High-NA)
gāo shùzhí kǒngjìng
高数值孔径
extreme ultraviolet (EUV) lithography
jí zǐwài guāngkè
极紫外光刻
technology
jìshù
技术
large-scale mass production
dàguīmó liàngchǎn
大规模量产
chip / semiconductor chip
xīnpiàn
芯片
structural particle
de
的
enterprise / company
qǐyè
企业
。

Intel (semiconductor company)
Yīngtèěr
英特尔
to announce
xuānbù
宣布
，
its
qí
其
Panther Lake (Intel chip codename)
Bào Hú
豹湖
processor
chǔlǐqì
处理器
already
yǐ
已
to begin
kāishǐ
开始
to ship / to deliver
chūhuò
出货
，
some / partial
bùfen
部分
layer / level
céngcì
层次
to adopt / to use
cǎiyòng
采用
ASML (chip equipment maker)
ASML
ASML
high numerical aperture (High-NA)
gāo shùzhí kǒngjìng
高数值孔径
extreme ultraviolet (EUV) lithography
jí zǐwài guāngkè
极紫外光刻
equipment / machinery
shèbèi
设备
to manufacture
zhìzào
制造
，
to set / to establish a record
chuàngxià
创下
this / the said
gāi
该
technology
jìshù
技术
commercial mass production
shāngyè liàngchǎn
商业量产
structural particle
de
的
the global first / first in the world
quánqiú shǒulì
全球首例
。
Intel (semiconductor company)
Yīngtèěr
英特尔
18A (Intel process node)
18A
18A
manufacturing process node
zhìchéng
制程
process technology
gōngyì
工艺
yield rate
liánglǜ
良率
has reached / already at
yǐ dá
已达
85 percent
85%
85%
，
to receive / to obtain
huò
获
ASML (chip equipment maker)
ASML
ASML
publicly
gōngkāi
公开
to confirm / to verify
zhèngshí
证实
，
expected to / likely to
yǒuwàng
有望
to help
bāngzhù
帮助
Intel (semiconductor company)
Yīngtèěr
英特尔
in / within
zài
在
foundry / contract manufacturing
dàigōng
代工
market
shìchǎng
市场
to attract
xīyǐn
吸引
more / additional
gèngduō
更多
orders
dìngdān
订单
。

July 18, 2026 at 8:30 AM

July 15
7 yuè 15 rì
7月15日
，
Intel (semiconductor company)
Yīngtèěr
英特尔
to announce
xuānbù
宣布
，
its
qí
其
codename
dàihào
代号
Panther Lake (Intel chip codename)
Bào Hú
豹湖
structural particle
de
的
Core Ultra (Intel processor series)
Core Ultra
Core Ultra
series
xìliè
系列
processor
chǔlǐqì
处理器
already
yǐ
已
to begin
kāishǐ
开始
to / toward
xiàng
向
customer / client
kèhù
客户
to ship / to deliver
chūhuò
出货
，
among which / of which
qízhōng
其中
some / partial
bùfen
部分
layer / level
céngcì
层次
to adopt / to use
cǎiyòng
采用
ASML (chip equipment maker)
ASML
ASML
high numerical aperture (High-NA)
gāo shùzhí kǒngjìng
高数值孔径
extreme ultraviolet (EUV) lithography
jí zǐwài guāngkè
极紫外光刻
equipment / machinery
shèbèi
设备
to complete / to accomplish
wánchéng
完成
to manufacture
zhìzào
制造
。
this
zhè
这
is / to be
shì
是
the said / this
gāi
该
technology
jìshù
技术
for the first time
shǒucì
首次
passive marker
bèi
被
to be used for
yòng yú
用于
high-volume / high-yield
gāo chǎnliàng
高产量
commercial
shāngyè
商业
logic chip
luójí xīnpiàn
逻辑芯片
structural particle
de
的
large-scale mass production
dàguīmó liàngchǎn
大规模量产
，
ASML (chip equipment maker)
ASML
ASML
to / will (formal)
jiāng
将
it / this
qí
其
to characterize as / to classify as
dìngxìng wéi
定性为
semiconductor
bàndǎotǐ
半导体
manufacturing industry
zhìzàoyè
制造业
structural particle
de
的
historic / of historical significance
lìshǐxìng
历史性
milestone
lǐchéngbēi
里程碑
。
Intel (semiconductor company)
Yīngtèěr
英特尔
18A (Intel process node)
18A
18A
manufacturing process node
zhìchéng
制程
process technology
gōngyì
工艺
yield rate
liánglǜ
良率
already
yǐ
已
to rise to / to improve to
tíshēng zhì
提升至
85 percent
85%
85%
，
to reach / to attain
dádào
达到
with / and
yǔ
与
traditional / conventional
chuántǒng
传统
extreme ultraviolet (EUV) lithography
jí zǐwài guāngkè
极紫外光刻
platform
píngtái
平台
comparable / equivalent
xiāngdāng
相当
structural particle
de
的
level / standard
shuǐpíng
水平
，
and / furthermore
bìng
并
to receive / to obtain
huò
获
ASML (chip equipment maker)
ASML
ASML
publicly
gōngkāi
公开
to confirm / to verify
zhèngshí
证实
。
high numerical aperture (High-NA)
gāo shùzhí kǒngjìng
高数值孔径
extreme ultraviolet (EUV) lithography
jí zǐwài guāngkè
极紫外光刻
equipment / machinery
shèbèi
设备
to be capable of / able to
nénggòu
能够
to cause / to make (formal)
jiāng
将
chip
xīnpiàn
芯片
on / upon
shàng
上
structural particle
de
的
circuit / wiring
xiànlù
线路
pattern / design
túàn
图案
to etch / etching
kèshí
刻蚀
complement particle
de
得
even more
gèng wéi
更为
fine / precise / detailed
jīngxì
精细
，
thereby / consequently
cóngér
从而
in / within
zài
在
the same / equal
tóngděng
同等
area
miànjī
面积
within / inside
nèi
内
to integrate / integration
jíchéng
集成
more / even more
gèngduō
更多
transistor
jīngtǐguǎn
晶体管
。
this time / on this occasion
cǐ cì
此次
mass production
liàngchǎn
量产
structural particle
de
的
processor
chǔlǐqì
处理器
only / merely
jǐn
仅
in / on
zài
在
a small number of / minority
shǎoshù
少数
key / critical
guānjiàn
关键
layer / level
céngcì
层次
on
shàng
上
to adopt / to use
cǎiyòng
采用
completion particle
le
了
high numerical aperture (High-NA)
gāo shùzhí kǒngjìng
高数值孔径
technology
jìshù
技术
，
the rest / remaining
qíyú
其余
layers / levels
céngcì
层次
still / yet
réng
仍
with / alongside
yǔ
与
traditional / conventional
chuántǒng
传统
extreme ultraviolet (EUV) lithography
jí zǐwài guāngkè
极紫外光刻
equipment
shèbèi
设备
in parallel / simultaneously
bìngxíng
并行
to use
shǐyòng
使用
。
ASML (chip equipment maker)
ASML
ASML
to expect / forecast
yùjì
预计
，
high numerical aperture (High-NA)
gāo shùzhí kǒngjìng
高数值孔径
system
xìtǒng
系统
will (future marker)
jiāng
将
in / during
yú
于
between 2026 and 2027
2026 nián zhì 2027 nián jiān
2026年至2027年间
at / in
zài
在
more / additional
gèngduō
更多
customer / client
kèhù
客户
factory / fab
gōngchǎng
工厂
to enter
jìnrù
进入
production
shēngchǎn
生产
verification / validation
yànzhèng
验证
stage / phase
jiēduàn
阶段
。
analyst / analysts
fēnxīshī
分析师
to believe / to consider
rènwéi
认为
，
this / this particular
zhè yī
这一
breakthrough
tūpò
突破
to help / to contribute to
yǒuzhùyú
有助于
Intel (semiconductor company)
Yīngtèěr
英特尔
foundry / contract manufacturing
dàigōng
代工
business / operations
yèwù
业务
to obtain / to secure
huòdé
获得
more / additional
gèngduō
更多
major client / key account
dà kèhù
大客户
orders
dìngdān
订单
，
further / additionally
jìn yī bù
进一步
to narrow / to reduce
suōxiǎo
缩小
with
yǔ
与
TSMC (Taiwan Semiconductor Manufacturing)
Táijīdiàn
台积电
structural particle
de
的
technology
jìshù
技术
gap / difference
chājù
差距
。
ASML (chip equipment maker)
ASML
ASML
immediately / thereupon
suíjí
随即
to raise / to revise upward
shàngdiào
上调
completion particle
le
了
the year 2026
2026 nián
2026年
full year / whole year
quánnián
全年
performance / results
yèjì
业绩
forecast / expectation
yùqī
预期
，
artificial intelligence
réngōng zhìnéng
人工智能
to drive / to propel
qūdòng
驱动
structural particle
de
的
advanced
xiānjìn
先进
lithography equipment
guāngkè shèbèi
光刻设备
demand
xūqiú
需求
continuously / sustained
chíxù
持续
to climb / to rise steadily
pānshēng
攀升
is
shì
是
important / key
zhòngyào
重要
driving factor
tuīdòng yīnsù
推动因素
one of
zhīyī
之一
。

News in English

Science & Technology

Intel Becomes First Company to Ship High-Volume Logic Chips Using ASML High-NA EUV Technology

Intel announced that its Panther Lake Core Ultra processors are shipping to customers, with select layers produced using ASML High-NA EUV equipment, marking the first commercial mass production use of this technology. Intel 18A process yield has reached 85 percent, confirmed by ASML, a milestone that could help Intel attract more foundry customers.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
，
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
，
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products