·HSK 6

Huawei
huáwéi
华为
advances
tuījìn
推进
1.4 nanometer
1.4 nànmǐ
1.4纳米
LogicFolding
LogicFolding
LogicFolding
chip
xīnpiàn
芯片
technology
jìshù
技术
。

Huawei

huáwéi

华为

announces

xuānbù

宣布

will be

jiāngyú

将于

2031

2031 nián

2031年

achieve

shíxiàn

实现

1.4 nanometer

1.4 nànmǐ

1.4纳米

chip

xīnpiàn

芯片

。

this

gāi

该

technology

jìshù

技术

will

jiāng

将

narrow

suōxiǎo

缩小

with

yǔ

与

TSMC

táijījì diàn

台积电

的

gap

chājù

差距

。

June 30, 2026 at 2:48 AM

Huawei

huáwéi

华为

semiconductor

bàndǎotǐ

半导体

business

yèwù

业务

executive

fùzérén

负责人

He Tingbo

hèdìng

贺定

bó

博

zài

在

May

wǔyuè

5月

announced

xuānbù

宣布

this

gāi

该

breakthrough

tūpò

突破

。

Huawei

huáwéi

华为

and

yǔ

与

SMIC

zhōngxīn guójì

中芯国际

collaborated

hézuò

合作

develop

kāifā

开发

this

gāi

该

technology

jìshù

技术

currently

mùqián

目前

both

liǎngzhě

两者

differ by

xiāngchā

相差

approximately

yuē

约

five years

wǔ nián

五年

。

TSMC

táijījì diàn

台积电

expects

yùjì

预计

2028

2028 nián

2028年

achieve

shíxiàn

实现

1.4 nanometer

1.4 nànmǐ

1.4纳米

process

gōngyì

工艺

means

yìwèi zhe

意味着

TSMC

táijījì diàn

台积电

will

jiāng

将

lead

lǐngxiān

领先

Huawei

huáwéi

华为

several years

shùnián

数年

。

this

gāi

该

advanced

xiānnjìn

先进

process

gōngyì

工艺

的

development

kāifā

开发

reflects

tǐxiàn

体现

了

China

zhōngguó

中国

chip

xīnpiàn

芯片

industry

chǎnyè

产业

的

independent

zìzhǔ

自主

innovation

chuàngxīn

创新

efforts

nǔlì

努力

。

United States

měiguó

美国

toward China

duìhuá

对华

chip

xīnpiàn

芯片

technology

jìshù

技术

restrictions

guǎnzhì

管制

conversely

fǎn'ér

反而

promoted

cùjìn

促进

了

China

zhōngguó

中国

domestic

běntǔ

本土

technology

jìshù

技术

的

development

fāzhǎn

发展

。

LogicFolding

technology

jìshù

技术

represents

dàibiǎo

代表

China

zhōngguó

中国

zài

在

semiconductor

bàndǎotǐ

半导体

field

lǐngyù

领域

的

important

zhònyào

重要

achievement

chéngjiù

成就

。

New Words

bàndǎotǐ

半导体

semiconductor

gōngyì

工艺

process

nànmǐ

纳米

nanometer

LogicFolding

tūpò

突破

breakthrough

lǐngxiān

领先

lead

chājù

差距

gap

zìzhǔ chuàngxīn

自主创新

independent innovation

chéngjiù

成就

achievement

lǐngyù

领域

field

fāzhǎn

发展

development

tǐxiàn

体现

reflects

News in English

Science & Technology

Huawei Advances 1.4 Nanometer LogicFolding Chip Technology

Huawei announces it will achieve 1.4 nanometer chip production by 2031. This advanced technology will significantly narrow the gap with TSMC.

Huawei semiconductor executive He Tingbo announced in May that the company will achieve 1.4 nanometer chip production by 2031 using LogicFolding technology developed in partnership with SMIC. Currently, the two companies lag TSMC by approximately five years in advanced chip manufacturing. TSMC expects to achieve 1.4 nanometer production in 2028, meaning the Taiwan company will maintain a several-year lead over Huawei. This advanced process development reflects China's independent innovation efforts in the semiconductor industry. US chip technology restrictions conversely accelerated China's domestic technology advancement. LogicFolding technology represents a significant achievement for China in the semiconductor field.

Huawei
huáwéi
华为
advances
tuījìn
推进
1.4 nanometer
1.4 nànmǐ
1.4纳米
LogicFolding
LogicFolding
LogicFolding
chip
xīnpiàn
芯片
technology
jìshù
技术
。

New Words

News in English

Huawei Advances 1.4 Nanometer LogicFolding Chip Technology

More in Science & Technology

China
Zhongguó
中国
AI
réngong zhìnéng
人工智能
models
móxíng
模型
captures
zhànlǐng
占领
market
shìchǎng
市场

UBTech
Yōubìxuǎn
优必选
U1
U1
U1
humanoid robot
rénxíng jīqìrén
人形机器人
launches
fābuō
发布
price
jiàgé
价格

Tencent (tech company)
Téngxùn
腾讯
in
zài
在
WeChat (messaging app)
Wēixìn
微信
to launch / roll out
tuīchū
推出
artificial intelligence
réngōng zhìnéng
人工智能
assistant
zhùshǒu
助手
Xiaowei (AI assistant name)
Xiǎowēi
小微
。

Huaweihuáwéi华为advancestuījìn推进1.4 nanometer1.4 nànmǐ1.4纳米LogicFoldingLogicFoldingLogicFoldingchipxīnpiàn芯片technologyjìshù技术。

New Words

News in English

Huawei Advances 1.4 Nanometer LogicFolding Chip Technology

More in Science & Technology

ChinaZhongguó中国AIréngong zhìnéng人工智能modelsmóxíng模型captureszhànlǐng占领marketshìchǎng市场

UBTechYōubìxuǎn优必选U1U1U1humanoid robotrénxíng jīqìrén人形机器人launchesfābuō发布pricejiàgé价格

Tencent (tech company)Téngxùn腾讯inzài在WeChat (messaging app)Wēixìn微信to launch / roll outtuīchū推出artificial intelligenceréngōng zhìnéng人工智能assistantzhùshǒu助手Xiaowei (AI assistant name)Xiǎowēi小微。

Huawei
huáwéi
华为
advances
tuījìn
推进
1.4 nanometer
1.4 nànmǐ
1.4纳米
LogicFolding
LogicFolding
LogicFolding
chip
xīnpiàn
芯片
technology
jìshù
技术
。

China
Zhongguó
中国
AI
réngong zhìnéng
人工智能
models
móxíng
模型
captures
zhànlǐng
占领
market
shìchǎng
市场

UBTech
Yōubìxuǎn
优必选
U1
U1
U1
humanoid robot
rénxíng jīqìrén
人形机器人
launches
fābuō
发布
price
jiàgé
价格

Tencent (tech company)
Téngxùn
腾讯
in
zài
在
WeChat (messaging app)
Wēixìn
微信
to launch / roll out
tuīchū
推出
artificial intelligence
réngōng zhìnéng
人工智能
assistant
zhùshǒu
助手
Xiaowei (AI assistant name)
Xiǎowēi
小微
。