·HSK 6

Huawei
huáwéi
华为
advances
tuījìn
推进
1.4 nanometer
1.4 nànmǐ
1.4纳米
LogicFolding
LogicFolding
LogicFolding
chip
xīnpiàn
芯片
technology
jìshù
技术
。

Huawei

huáwéi

华为

announces

xuānbù

宣布

will be

jiāngyú

将于

2031

2031 nián

2031年

achieve

shíxiàn

实现

1.4 nanometer

1.4 nànmǐ

1.4纳米

chip

xīnpiàn

芯片

。

this

gāi

该

technology

jìshù

技术

will

jiāng

将

narrow

suōxiǎo

缩小

with

yǔ

与

TSMC

táijījì diàn

台积电

的

gap

chājù

差距

。

June 30, 2026 at 2:48 AM

Huawei

huáwéi

华为

semiconductor

bàndǎotǐ

半导体

business

yèwù

业务

executive

fùzérén

负责人

He Tingbo

hèdìng

贺定

bó

博

zài

在

May

wǔyuè

5月

announced

xuānbù

宣布

this

gāi

该

breakthrough

tūpò

突破

。

Huawei

huáwéi

华为

and

yǔ

与

SMIC

zhōngxīn guójì

中芯国际

collaborated

hézuò

合作

develop

kāifā

开发

this

gāi

该

technology

jìshù

技术

currently

mùqián

目前

both

liǎngzhě

两者

differ by

xiāngchā

相差

approximately

yuē

约

five years

wǔ nián

五年

。

TSMC

táijījì diàn

台积电

expects

yùjì

预计

2028

2028 nián

2028年

achieve

shíxiàn

实现

1.4 nanometer

1.4 nànmǐ

1.4纳米

process

gōngyì

工艺

means

yìwèi zhe

意味着

TSMC

táijījì diàn

台积电

will

jiāng

将

lead

lǐngxiān

领先

Huawei

huáwéi

华为

several years

shùnián

数年

。

this

gāi

该

advanced

xiānnjìn

先进

process

gōngyì

工艺

的

development

kāifā

开发

reflects

tǐxiàn

体现

了

China

zhōngguó

中国

chip

xīnpiàn

芯片

industry

chǎnyè

产业

的

independent

zìzhǔ

自主

innovation

chuàngxīn

创新

efforts

nǔlì

努力

。

United States

měiguó

美国

toward China

duìhuá

对华

chip

xīnpiàn

芯片

technology

jìshù

技术

restrictions

guǎnzhì

管制

conversely

fǎn'ér

反而

promoted

cùjìn

促进

了

China

zhōngguó

中国

domestic

běntǔ

本土

technology

jìshù

技术

的

development

fāzhǎn

发展

。

LogicFolding

technology

jìshù

技术

represents

dàibiǎo

代表

China

zhōngguó

中国

zài

在

semiconductor

bàndǎotǐ

半导体

field

lǐngyù

领域

的

important

zhònyào

重要

achievement

chéngjiù

成就

。

New Words

bàndǎotǐ

半导体

semiconductor

gōngyì

工艺

process

nànmǐ

纳米

nanometer

LogicFolding

tūpò

突破

breakthrough

lǐngxiān

领先

lead

chājù

差距

gap

zìzhǔ chuàngxīn

自主创新

independent innovation

chéngjiù

成就

achievement

lǐngyù

领域

field

fāzhǎn

发展

development

tǐxiàn

体现

reflects

News in English

Science & Technology

Huawei Advances 1.4 Nanometer LogicFolding Chip Technology

Huawei announces it will achieve 1.4 nanometer chip production by 2031. This advanced technology will significantly narrow the gap with TSMC.

Huawei semiconductor executive He Tingbo announced in May that the company will achieve 1.4 nanometer chip production by 2031 using LogicFolding technology developed in partnership with SMIC. Currently, the two companies lag TSMC by approximately five years in advanced chip manufacturing. TSMC expects to achieve 1.4 nanometer production in 2028, meaning the Taiwan company will maintain a several-year lead over Huawei. This advanced process development reflects China's independent innovation efforts in the semiconductor industry. US chip technology restrictions conversely accelerated China's domestic technology advancement. LogicFolding technology represents a significant achievement for China in the semiconductor field.

Huawei
huáwéi
华为
advances
tuījìn
推进
1.4 nanometer
1.4 nànmǐ
1.4纳米
LogicFolding
LogicFolding
LogicFolding
chip
xīnpiàn
芯片
technology
jìshù
技术
。

New Words

News in English

Huawei Advances 1.4 Nanometer LogicFolding Chip Technology

More in Science & Technology

United States
měiguó
美国
Congress
guóhuì
国会
approves
pīzhǔn
批准
artificial intelligence
réngōng zhìnéng
人工智能
regulation
jiānguǎn
监管
framework
kuàngjià
框架
。

OpenAI (AI company)
OpenAI
OpenAI
to launch
tuīchū
推出
GPT-6 (AI model)
GPT-6
GPT-6
and
yǔ
与
intelligent
zhìnéng
智能
interface
jièmiàn
界面
feature
gōngnéng
功能
。

Microsoft
Wēiruǎn
微软
to launch / to release
tuīchū
推出
Work IQ (Microsoft enterprise AI tool)
Work IQ
Work IQ
，
to let / to allow
ràng
让
Copilot (Microsoft AI assistant)
Copilot
Copilot
to connect to
liánjiē
连接
enterprise data
qǐyè shùjù
企业数据
。

Huaweihuáwéi华为advancestuījìn推进1.4 nanometer1.4 nànmǐ1.4纳米LogicFoldingLogicFoldingLogicFoldingchipxīnpiàn芯片technologyjìshù技术。

New Words

News in English

Huawei Advances 1.4 Nanometer LogicFolding Chip Technology

More in Science & Technology

United Statesměiguó美国Congressguóhuì国会approvespīzhǔn批准artificial intelligenceréngōng zhìnéng人工智能regulationjiānguǎn监管frameworkkuàngjià框架。

OpenAI (AI company)OpenAIOpenAIto launchtuīchū推出GPT-6 (AI model)GPT-6GPT-6andyǔ与intelligentzhìnéng智能interfacejièmiàn界面featuregōngnéng功能。

MicrosoftWēiruǎn微软to launch / to releasetuīchū推出Work IQ (Microsoft enterprise AI tool)Work IQWork IQ，to let / to allowràng让Copilot (Microsoft AI assistant)CopilotCopilotto connect toliánjiē连接enterprise dataqǐyè shùjù企业数据。

Huawei
huáwéi
华为
advances
tuījìn
推进
1.4 nanometer
1.4 nànmǐ
1.4纳米
LogicFolding
LogicFolding
LogicFolding
chip
xīnpiàn
芯片
technology
jìshù
技术
。

United States
měiguó
美国
Congress
guóhuì
国会
approves
pīzhǔn
批准
artificial intelligence
réngōng zhìnéng
人工智能
regulation
jiānguǎn
监管
framework
kuàngjià
框架
。

OpenAI (AI company)
OpenAI
OpenAI
to launch
tuīchū
推出
GPT-6 (AI model)
GPT-6
GPT-6
and
yǔ
与
intelligent
zhìnéng
智能
interface
jièmiàn
界面
feature
gōngnéng
功能
。

Microsoft
Wēiruǎn
微软
to launch / to release
tuīchū
推出
Work IQ (Microsoft enterprise AI tool)
Work IQ
Work IQ
，
to let / to allow
ràng
让
Copilot (Microsoft AI assistant)
Copilot
Copilot
to connect to
liánjiē
连接
enterprise data
qǐyè shùjù
企业数据
。