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technology
kē jì
科技
·HSK 6

Huawei
huáwéi
华为
advances
tuījìn
推进
1.4 nanometer
1.4 nànmǐ
1.4纳米
LogicFolding
LogicFolding
LogicFolding
chip
xīnpiàn
芯片
technology
jìshù
技术
。

Huawei
huáwéi
华为
announces
xuānbù
宣布
will be
jiāngyú
将于
2031
2031 nián
2031年
achieve
shíxiàn
实现
1.4 nanometer
1.4 nànmǐ
1.4纳米
chip
xīnpiàn
芯片
。
this
gāi
该
technology
jìshù
技术
will
jiāng
将
narrow
suōxiǎo
缩小
with
yǔ
与
TSMC
táijījì diàn
台积电
of
de
的
gap
chājù
差距
。

June 30, 2026 at 2:48 AM

Huawei
huáwéi
华为
semiconductor
bàndǎotǐ
半导体
business
yèwù
业务
executive
fùzérén
负责人
He Tingbo
hèdìng
贺定
bó
博
at
zài
在
May
wǔyuè
5月
announced
xuānbù
宣布
this
gāi
该
breakthrough
tūpò
突破
。
Huawei
huáwéi
华为
and
yǔ
与
SMIC
zhōngxīn guójì
中芯国际
collaborated
hézuò
合作
develop
kāifā
开发
this
gāi
该
technology
jìshù
技术
currently
mùqián
目前
both
liǎngzhě
两者
differ by
xiāngchā
相差
approximately
yuē
约
five years
wǔ nián
五年
。
TSMC
táijījì diàn
台积电
expects
yùjì
预计
2028
2028 nián
2028年
achieve
shíxiàn
实现
1.4 nanometer
1.4 nànmǐ
1.4纳米
process
gōngyì
工艺
means
yìwèi zhe
意味着
TSMC
táijījì diàn
台积电
will
jiāng
将
lead
lǐngxiān
领先
Huawei
huáwéi
华为
several years
shùnián
数年
。
this
gāi
该
advanced
xiānnjìn
先进
process
gōngyì
工艺
of
de
的
development
kāifā
开发
reflects
tǐxiàn
体现
le
了
China
zhōngguó
中国
chip
xīnpiàn
芯片
industry
chǎnyè
产业
of
de
的
independent
zìzhǔ
自主
innovation
chuàngxīn
创新
efforts
nǔlì
努力
。
United States
měiguó
美国
toward China
duìhuá
对华
chip
xīnpiàn
芯片
technology
jìshù
技术
restrictions
guǎnzhì
管制
conversely
fǎn'ér
反而
promoted
cùjìn
促进
le
了
China
zhōngguó
中国
domestic
běntǔ
本土
technology
jìshù
技术
of
de
的
development
fāzhǎn
发展
。
LogicFolding
LogicFolding
LogicFolding
technology
jìshù
技术
represents
dàibiǎo
代表
China
zhōngguó
中国
in
zài
在
semiconductor
bàndǎotǐ
半导体
field
lǐngyù
领域
of
de
的
important
zhònyào
重要
achievement
chéngjiù
成就
。

New Words

bàndǎotǐ
半导体
semiconductor
gōngyì
工艺
process
nànmǐ
纳米
nanometer
LogicFolding
LogicFolding
LogicFolding
tūpò
突破
breakthrough
lǐngxiān
领先
lead
chājù
差距
gap
zìzhǔ chuàngxīn
自主创新
independent innovation
chéngjiù
成就
achievement
lǐngyù
领域
field
fāzhǎn
发展
development
tǐxiàn
体现
reflects

News in English

Science & Technology

Huawei Advances 1.4 Nanometer LogicFolding Chip Technology

Huawei announces it will achieve 1.4 nanometer chip production by 2031. This advanced technology will significantly narrow the gap with TSMC.

Huawei semiconductor executive He Tingbo announced in May that the company will achieve 1.4 nanometer chip production by 2031 using LogicFolding technology developed in partnership with SMIC. Currently, the two companies lag TSMC by approximately five years in advanced chip manufacturing. TSMC expects to achieve 1.4 nanometer production in 2028, meaning the Taiwan company will maintain a several-year lead over Huawei. This advanced process development reflects China's independent innovation efforts in the semiconductor industry. US chip technology restrictions conversely accelerated China's domestic technology advancement. LogicFolding technology represents a significant achievement for China in the semiconductor field.

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jīqìrén
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shìzhí
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United States / American
Měiguó
美国
space agency / NASA
yǔháng jú
宇航局
to find / to discover
zhǎodào
找到
new
xīn
新
method / way
fāngfǎ
方法
to extend / to prolong
yáncháng
延长
Voyager 2 (spacecraft)
Lǚxíngzhě 2 hào
旅行者2号
to use / operation
shǐyòng
使用
lifespan / service life
shòumìng
寿命
。

NASA Engineers Find New Way to Extend Voyager 2 Mission After 49 Years in Space

global / worldwide
quánqiú
全球
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bàndǎotǐ
半导体
second quarter / Q2
dì-èr jìdù
第二季度
sales revenue
xiāoshòué
销售额
to set (a record)
chuàng
创
all-time record high
lìshǐ xīngāo
历史新高
。

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