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technology
kē jì
科技
·HSK 5

Huawei
huáwéi
华为
chip
xīnpiàn
芯片
production output
chǎnliàng
产量
increase to
zēngzhì
增至
60
60
60
ten thousand
wàn
万

Huawei
huáwéi
华为
plan
jìhuà
计划
2026
2026
2026
year
nián
年
Ascend
Ascend
Ascend
910C
910C
910C
chip
xīnpiàn
芯片
production
chǎnliàng
产量
double
fānbèi
翻倍
。
company
gōngsī
公司
with
yǔ
与
state-owned
guóyǒu
国有
foundry
dàigōng chǎng
代工厂
SMIC
zhōng xīn guójì
中芯国际
cooperate
hézuò
合作
achieve
shíxiàn
实现
this
gāi
该
target
mùbiāo
目标
。

July 24, 2026 at 5:14 AM

Huawei
huáwéi
华为
company
gōngsī
公司
plan
jìhuà
计划
in
zài
在
2026
2026
2026
year
nián
年
significantly
dàfú
大幅
increase
tíshēng
提升
Ascend
Ascend
Ascend
910C
910C
910C
artificial intelligence
réngōng zhìnéng
人工智能
chip
xīnpiàn
芯片
de
的
production output
chǎnliàng
产量
。
according to
gēnjù
根据
relevant
xiāngguān
相关
report
bàodào
报道
Huawei
huáwéi
华为
with
yǔ
与
national
guójiā
国家
controlling
kònggǔ
控股
de
的
Semiconductor Manufacturing International Corporation
zhōng xīn guójì
中芯国际
cooperate
hézuò
合作
accelerate
jiāsù
加速
production
shēngchǎn
生产
。
Ascend
Ascend
Ascend
910C
910C
910C
is
shì
是
Huawei
huáwéi
华为
independent
zìzhǔ
自主
research and develop
yánfā
研发
de
的
high-performance
gāo xìngnéng
高性能
artificial intelligence
réngōng zhìnéng
人工智能
processor
chǔlǐ qì
处理器
mainly
zhǔyào
主要
used for
yòngyú
用于
data
shùjù
数据
center
zhōngxīn
中心
and
hé
和
cloud
yún
云
computing
jìsuàn
计算
applications
yìngyòng
应用
。
this
gāi
该
chip
xīnpiàn
芯片
since
zì
自
2023
2023
2023
year
nián
年
released
fābù
发布
since
yǐlái
以来
demand
xūqiú
需求
continuous
chíxù
持续
growth
zēngzhǎng
增长
。
production
chǎnliàng
产量
de
的
increase
zēngjiā
增加
will
jiāng
将
help
yǒuzhùyú
有助于
meet
mǎnzú
满足
global
quánqiú
全球
artificial intelligence
réngōng zhìnéng
人工智能
chip
xīnpiàn
芯片
de
的
strong
wàngshèng
旺盛
demand
xūqiú
需求
。
this
cǐ
此
move
jǔ
举
further
jìnyībù
进一步
reflect
tǐxiàn
体现
le
了
China
zhōngguó
中国
in
zài
在
high-end
gāoduān
高端
chip
xīnpiàn
芯片
manufacturing
zhìzào
制造
field
lǐngyù
领域
de
的
technology
jìshù
技术
progress
jìnbù
进步
。

New Words

zìzhǔ yánfā
自主研发
independently developed
gāo xìngnéng
高性能
high-performance
chǔlǐ qì
处理器
processor
chǎnliàng
产量
production output
xūqiú
需求
demand
shùjù zhōngxīn
数据中心
data center
yún jìsuàn
云计算
cloud computing
hézuò
合作
cooperation
jiāsù
加速
accelerate
jìshù jìnbù
技术进步
technological progress

News in English

Science & Technology

Huawei Boosts Ascend 910C AI Chip Production to 600,000 Units Annually

Huawei plans to nearly double its Ascend 910C AI chip production in 2026, with the state-backed foundry SMIC supporting the expansion to approximately 600,000 units annually.

Huawei plans to significantly increase production of its Ascend 910C artificial intelligence chip in 2026. According to reports, Huawei is collaborating with state-controlled Semiconductor Manufacturing International Corporation to accelerate output. The Ascend 910C is a high-performance AI processor independently developed by Huawei, primarily used for data center and cloud computing applications. Since its 2023 release, demand for the chip has remained strong and continuously growing. The production increase will help meet robust global demand for AI chips. This development further demonstrates Chinas technological progress in advanced semiconductor manufacturing.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
，
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
，
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products