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technology
kē jì
科技
·HSK 3

Huawei
Huáwéi
华为
plans to
jìhuà
计划
in 2026
2026 nián
2026年
(future marker)
jiāng
将
Ascend 910C AI chip
Ascend 910C
Ascend 910C
production volume
chǎnliàng
产量
to double
fānbèi
翻倍
to
zhì
至
600,000 units
liùshí wàn piàn
六十万片
。

Huawei
Huáwéi
华为
plans to
jìhuà
计划
this year
jīnnián
今年
(future marker)
jiāng
将
Ascend 910C AI chip
Ascend 910C
Ascend 910C
chip
xīnpiàn
芯片
output
chǎnliàng
产量
to double
fānbèi
翻倍
to
zhì
至
approximately
yuē
约
600,000 units
liùshí wàn piàn
六十万片
。
this target
zhè yī mùbiāo
这一目标
reflects
fǎnyìng le
反映了
China
Zhōngguó
中国
domestic
guónèi
国内
AI
AI
AI
chip
xīnpiàn
芯片
demand
xūqiú
需求
(possessive particle)
de
的
rapid growth
kuàisù zēngzhǎng
快速增长
。

April 6, 2026 at 12:00 PM

Huawei
Huáwéi
华为
plans to
jìhuà
计划
this year
jīnnián
今年
significantly
dàfú
大幅
to increase
tígāo
提高
artificial intelligence
réngōng zhìnéng
人工智能
chip
xīnpiàn
芯片
(possessive particle)
de
的
production volume
chǎnliàng
产量
。
Ascend 910C (Huawei AI chip)
Ascend 910C
Ascend 910C
is
shì
是
Huawei
Huáwéi
华为
currently
mùqián
目前
most powerful
zuì qiángdà de
最强大的
domestically produced
guóchǎn
国产
AI
AI
AI
chip
xīnpiàn
芯片
。
in 2025
2025 nián
2025年
，
Huawei
Huáwéi
华为
produced
shēngchǎn le
生产了
approximately
yuē
约
300,000 units
sānshí wàn piàn
三十万片
this chip
gāi xīnpiàn
该芯片
。
in 2026
2026 nián
2026年
，
Huawei
Huáwéi
华为
plans to
jìhuà
计划
(future marker)
jiāng
将
output
chǎnliàng
产量
increase to
tígāo dào
提高到
approximately
yuē
约
600,000 units
liùshí wàn piàn
六十万片
。
domestic
guónèi
国内
tech companies
kējì gōngsī
科技公司
for
duì
对
AI
réngōng zhìnéng
人工智能
chips
xīnpiàn
芯片
(possessive particle)
de
的
demand
xūqiú
需求
rapidly
kuàisù
快速
growing
zēngzhǎng
增长
。
ByteDance
Zìjié Tiàodòng
字节跳动
and
hé
和
Alibaba
Ālǐbābā
阿里巴巴
are
shì
是
Huawei
Huáwéi
华为
AI
AI
AI
chips
xīnpiàn
芯片
(possessive particle)
de
的
important
zhòngyào
重要
customers
kèhù
客户
。
this plan
zhè yī jìhuà
这一计划
helps
yǒuzhùyú
有助于
China
Zhōngguó
中国
to reduce
jiǎnshǎo
减少
for
duì
对
foreign
wàiguó
外国
chips
xīnpiàn
芯片
(possessive particle)
de
的
dependence
yīlài
依赖
。
analysts
fēnxīshī
分析师
stated
biǎoshì
表示
，
domestic
guónèi
国内
chip
xīnpiàn
芯片
industry
chǎnyè
产业
currently
zhèngzài
正在
rapidly
kuàisù
快速
developing
fāzhǎn
发展
。

New Words

huán
环
environment
bǎo
保
protect
yě
野
wild
shēng
生
life
dòng
动
move
wù
物
creature
bǎo
保
protect
hù
护
safeguard
kě
可
can
zài
再
again
shēng
生
renewable
néng
能
energy

News in English

Science & Technology

Huawei Plans to Double Ascend 910C AI Chip Output to 600,000 Units in 2026

Huawei is planning to nearly double its production of the Ascend 910C AI chip to around 600,000 units in 2026, as demand from Chinese tech giants surges.

Environmental conservation efforts expand dramatically. Wildlife populations recover in protected areas. Renewable energy adoption accelerates globally. Sustainable agriculture practices gain support. Carbon reduction targets become increasingly ambitious.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
，
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
，
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products