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technology
kē jì
科技
·HSK 6

Hua Hong Semiconductor (Chinese chipmaker)
Huáhóng Bàndǎotǐ
华虹半导体
to accelerate
jiāsù
加速
specialty / distinctive
tèsè
特色
process technology
gōngyì
工艺
strategic deployment / layout
bùjú
布局
，
to bet on / to wager
yāzhù
押注
AI (artificial intelligence)
AI
AI
to drive / to propel
qūdòng
驱动
(possessive/attributive particle)
de
的
demand
xūqiú
需求
growth
zēngzhǎng
增长
。

Hua Hong Semiconductor (Chinese chipmaker)
Huáhóng Bàndǎotǐ
华虹半导体
in / at
zài
在
the year 2026
2026 nián
2026年
first quarter
dì yī jìdù
第一季度
financial results / earnings
yèjì
业绩
briefing / earnings call
shuōmíng huì
说明会
on / at
shàng
上
to announce
xuānbù
宣布
，
will (future marker)
jiāng
将
to expand
kuòdà
扩大
specialty
tèsè
特色
chip / semiconductor
xīnpiàn
芯片
production capacity
chǎnnéng
产能
in order to / so as to
yǐ
以
to seize / to grasp
bǎwò
把握
AI (artificial intelligence)
AI
AI
to bring
dàilái
带来
(possessive/attributive particle)
de
的
market
shìchǎng
市场
opportunity
jīyù
机遇
。

May 15, 2026 at 4:00 PM

Hua Hong Semiconductor (Chinese chipmaker)
Huáhóng Bàndǎotǐ
华虹半导体
on (time marker)
yú
于
May 14th
5 yuè 14 rì
5月14日
to hold / to conduct
jǔxíng
举行
the year 2026
2026 nián
2026年
first quarter
dì yī jìdù
第一季度
financial results / earnings
yèjì
业绩
briefing / earnings call
shuōmíng huì
说明会
，
to elaborate / to expound
chǎnshù
阐述
(completed action particle)
le
了
company
gōngsī
公司
oriented toward / targeting
miàn xiàng
面向
AI (artificial intelligence)
AI
AI
era / age
shídài
时代
(possessive/attributive particle)
de
的
strategy
zhànlüè
战略
strategic deployment / layout
bùjú
布局
。
company
gōngsī
公司
management / senior leadership
guǎnlǐ céng
管理层
will (future marker)
jiāng
将
AI (artificial intelligence)
AI
AI
toward / for
duì
对
market
shìchǎng
市场
demand
xūqiú
需求
(possessive/attributive particle)
de
的
driving effect / stimulus
lādòng
拉动
to describe
miáoshù
描述
as / to be
wèi
为
"
unquestionably / undeniably
wú kě zhìyí
无可置疑
(possessive/attributive particle)
de
的
positive
zhèngmiàn
正面
impact / influence
yǐngxiǎng
影响
"。
company
gōngsī
公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
toward
xiàng
向
Wuxi (city in Jiangsu Province)
Wúxī
无锡
wafer fab / semiconductor foundry
jīngyuán chǎng
晶圆厂
to invest / to commit
tóurù
投入
approximately
yuē
约
$6 billion
60 yì měiyuán
60亿美元
，
in order to
yǐ
以
to expand / to build up
kuòchōng
扩充
specialty
tèsè
特色
manufacturing process
zhìchéng
制程
production capacity
chǎnnéng
产能
。
Hua Hong (short for Hua Hong Semiconductor)
Huáhóng
华虹
to focus on
zhuānzhù yú
专注于
power management
gōnglǜ guǎnlǐ
功率管理
、
embedded
qiànrùshì
嵌入式
non-volatile memory (NVM)
fēi huīfā xìng cúnchǔqì
非挥发性存储器
and / as well as
jí
及
analog
mónǐ
模拟
chip / semiconductor
xīnpiàn
芯片
and so on / et cetera
děng
等
specialty
tèsè
特色
process technology
gōngyì
工艺
domain / field
lǐngyù
领域
。
the above-mentioned
shàngshù
上述
technology
jìshù
技术
by (passive marker)
bèi
被
widely / extensively
guǎngfàn
广泛
to be applied to
yìngyòng yú
应用于
AI (artificial intelligence)
AI
AI
server
fúwùqì
服务器
and / as well as
jí
及
intelligent / smart
zhìnéng
智能
device / equipment
shèbèi
设备
，
localization / domestic production
guóchǎnhuà
国产化
trend
qūshì
趋势
currently / just
zhèng
正
further / to a greater degree
jìn yībù
进一步
to drive / to promote
tuīdòng
推动
related / relevant
xiāngguān
相关
demand
xūqiú
需求
。
in / at
zài
在
advanced
xiānjìn
先进
manufacturing process
zhìchéng
制程
aspect / area
fāngmiàn
方面
，
Hua Hong (short for Hua Hong Semiconductor)
Huáhóng
华虹
under its umbrella / subsidiary
qíxià
旗下
Huali Microelectronics (subsidiary of Hua Hong)
Huálì Wēidiànzǐ
华力微电子
currently
zhèng
正
to advance / to push forward
tuījìn
推进
7 nanometer
7 nàmǐ
7纳米
manufacturing process
zhìchéng
制程
(possessive/attributive particle)
de
的
mass production
liàngchǎn
量产
preparation / readiness
zhǔnbèi
准备
，
expected to / anticipated
yùjì
预计
by (time marker)
yú
于
end of 2026
2026 nián dǐ
2026年底
before
qián
前
to achieve / to realize
shíxiàn
实现
initial / preliminary
chūbù
初步
mass production
liàngchǎn
量产
。
this move / this action
cǐ jǔ
此举
will (future marker)
jiāng
将
to cause / to make
shǐ
使
Hua Hong (short for Hua Hong Semiconductor)
Huáhóng
华虹
to become
chéngwéi
成为
SMIC (Semiconductor Manufacturing International Corporation)
Zhōngxīn Guójì
中芯国际
beyond / outside of
zhī wài
之外
another (measure word for companies)
lìng yī jiā
另一家
to possess / to be equipped with
jùbèi
具备
advanced
xiānjìn
先进
manufacturing process
zhìchéng
制程
capability / ability
nénglì
能力
(possessive/attributive particle)
de
的
China
Zhōngguó
中国
domestic / home-grown
běntǔ
本土
wafer fab / semiconductor foundry
jīngyuán chǎng
晶圆厂
。

New Words

bandaoti
半导体
semiconductor
jiasu
加速
accelerate
gongyi
工艺
process
buju
布局
deployment
qudong
驱动
drive
xuqiu
需求
demand
jingyuan chang
晶圆厂
wafer fab
channeng
产能
capacity
liangchan
量产
mass production
guochanhua
国产化
localization

News in English

Science & Technology

Hua Hong Semiconductor Bets on AI-Driven Demand With Specialty Chip Expansion and Wuxi Capacity Push

Hua Hong Semiconductor announced at its Q1 2026 earnings call a plan to expand specialty chip capacity to capture AI-driven market opportunities. The company is committing around $6 billion to its Wuxi fab and advancing toward 7nm production by end of 2026.

Hua Hong Semiconductor held a first quarter 2026 earnings briefing on May 14, outlining its strategy for the AI era. The company describes AI's market demand stimulus as unquestionably positive impact. Hua Hong announced investing approximately $6 billion in its Wuxi wafer fab to expand specialty process capacity. Hua Hong focuses on power management, embedded non-volatile memory, and analog chip specialty processes. These technologies are widely applied to AI servers and smart devices, with domestic production trend further driving demand. Hua Hong's Huali Microelectronics subsidiary is advancing 7-nanometer process mass production, expected to achieve preliminary mass production by end of 2026. This positions Hua Hong alongside SMIC as another Chinese domestic wafer fab with advanced process capability.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
，
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
，
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products