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technology
kē jì
科技
·HSK 6

artificial intelligence
réngōng zhìnéng
人工智能
demand
xūqiú
需求
to drive / to push
tuīdòng
推动
global / worldwide
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
market
shìchǎng
市场
in 2026
2026 nián
2026年
sales revenue
xiāoshòu'é
销售额
to approach
jiējìn
接近
1 trillion US dollars
1 wànyì měiyuán
1万亿美元
。

industry
hángyè
行业
research
yánjiū
研究
institution / firm
jīgòu
机构
to forecast / to project
yùjì
预计
,
driven by / because of
shòu
受
artificial intelligence
réngōng zhìnéng
人工智能
infrastructure
jīchǔ shèshī
基础设施
construction / development
jiànshè
建设
demand
xūqiú
需求
driven
tuīdòng
推动
,
global
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
market
shìchǎng
市场
in 2026
2026 nián
2026年
sales revenue
xiāoshòu'é
销售额
will
jiāng
将
approach
jiējìn
接近
975.5 billion US dollars
9755 yì měiyuán
9755亿美元
。
generative
shēngchéngshì
生成式
AI (artificial intelligence)
AI
AI
chips
xīnpiàn
芯片
revenue
shōurù
收入
expected to / likely to
yǒuwàng
有望
alone / by itself
dāndú
单独
to break through / to exceed
tūpò
突破
500 billion US dollars
5000 yì měiyuán
5000亿美元
major threshold / milestone
dàguān
大关
。

April 16, 2026 at 10:00 PM

industry
hángyè
行业
analysis / research
fēnxī
分析
firm / institution
jīgòu
机构
Deloitte
Déqín
德勤
to release / to publish
fābù
发布
[particle]
de
的
latest / most recent
zuìxīn
最新
report
bàogào
报告
shows / indicates
xiǎnshì
显示
,
in 2026
2026 nián
2026年
global
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
market
shìchǎng
市场
sales revenue
xiāoshòu'é
销售额
projected to
yùjì
预计
will
jiāng
将
approach
jiējìn
接近
975.5 billion US dollars
9755 yì měiyuán
9755亿美元
,
from / away from
jù
距
historic / landmark
lìshǐxìng
历史性
[particle]
de
的
1 trillion
1 wànyì
1万亿
milestone / threshold
dàguān
大关
just one step away
jǐn yī bù zhī yáo
仅一步之遥
。
this
zhè yī
这一
growth
zēngzhǎng
增长
primarily
zhǔyào
主要
by / driven by
yóu
由
large-scale
dàguīmó
大规模
artificial intelligence
réngōng zhìnéng
人工智能
infrastructure
jīchǔ shèshī
基础设施
construction / development
jiànshè
建设
demand
xūqiú
需求
[passive marker]
suǒ
所
to drive / propelled by
qūdòng
驱动
,
generative
shēngchéngshì
生成式
AI (artificial intelligence)
AI
AI
chips
xīnpiàn
芯片
revenue
shōurù
收入
projected to
yùjì
预计
will
jiāng
将
alone / by itself
dāndú
单独
to exceed / to surpass
tūpò
突破
500 billion US dollars
5000 yì měiyuán
5000亿美元
,
accounting for approximately
yuē zhàn
约占
semiconductor
bàndǎotǐ
半导体
total sales revenue
zǒng xiāoshòu'é
总销售额
[particle]
de
的
one half
yībàn
一半
。
in
zài
在
sub-segment / breakdown
xìfēn
细分
sector / field
lǐngyù
领域
within / among
zhōng
中
,
logic
luójí
逻辑
chips
xīnpiàn
芯片
and
yǔ
与
memory
nèicún
内存
chips
xīnpiàn
芯片
both
jūn
均
to exhibit / to show
chéngxiàn
呈现
out / forth
chū
出
exceeding
chāoguò
超过
30 percent
bǎifēnzhī sānshí
30%
[particle]
de
的
year-over-year
tóngbǐ
同比
growth
zēngzhǎng
增长
trend / dynamic
tàishì
态势
,
growth momentum
zēngshì
增势
so strong / of such strength
zhī qiáng
之强
is
wèi
为
in recent years
jìn nián
近年
...
lái
来
[emphatic marker]
suǒ
所
rarely seen / uncommon
hǎnjiàn
罕见
。
TSMC (Taiwan Semiconductor Manufacturing Company)
Táijīdiàn
台积电
as / serving as
zuòwéi
作为
global
quánqiú
全球
advanced
xiānjìn
先进
chips
xīnpiàn
芯片
manufacturing
zhìzào
制造
[particle]
de
的
core
héxīn
核心
supplier
gōngyìngshāng
供应商
,
is currently
zhèng
正
bearing / facing
chéngshòu
承受
from
láizì
来自
major / various large
gè dà
各大
technology
kējì
科技
companies
gōngsī
公司
[particle]
de
的
enormous / tremendous
jùdà
巨大
production capacity
chǎnnéng
产能
demand
xūqiú
需求
pressure
yālì
压力
。
however / yet
rán'ér
然而
,
High Bandwidth Memory (HBM)
gāo dàikuān nèicún
高带宽内存
[particle]
de
的
supply
gōngyìng
供应
bottleneck
píngjǐng
瓶颈
and
yǔ
与
advanced
xiānjìn
先进
packaging
fēngzhuāng
封装
capacity
chǎnnéng
产能
[particle]
de
的
insufficiency / shortage
bùzú
不足
,
is currently
zhèng
正
constraining / limiting
zhìyuē
制约
[ongoing marker]
zhe
着
AI (artificial intelligence)
AI
AI
accelerator chip
jiāsùqì
加速器
[particle]
de
的
overall / total
zhěngtǐ
整体
shipment / delivery
chūhuò
出货
scale / volume
guīmó
规模
。
the Netherlands
Hélán
荷兰
semiconductor
bàndǎotǐ
半导体
equipment
shèbèi
设备
giant / major player
jùtóu
巨头
ASML (semiconductor equipment company)
ASML
ASML
CEO / Chief Executive Officer
shǒuxí zhíxíngguān
首席执行官
stated
biǎoshì
表示
,
customers / clients
kèhù
客户
are currently
zhèngzài
正在
significantly
dàfú
大幅
accelerating
jiāsù
加速
to expand production capacity
kuò chǎn
扩产
plans
jìhuà
计划
,
showing / demonstrating
xiǎnshì chū
显示出
toward
duì
对
AI (artificial intelligence)
AI
AI
driven
qūdòng
驱动
demand
xūqiú
需求
long-term
chángqī
长期
continuing / sustained
chíxù
持续
[particle]
de
的
confidence
xìnxīn
信心
。
at the same time / meanwhile
yǔ cǐ tóngshí
与此同时
,
China
Zhōngguó
中国
under
zài
在
export
chūkǒu
出口
controls / restrictions
guǎnzhì
管制
pressure
yālì
压力
under
xià
下
to intensify / to increase
jiādà
加大
[completion marker]
le
了
toward
duì
对
domestic / local
běntǔ
本土
chip
xīnpiàn
芯片
design
shèjì
设计
and
yǔ
与
manufacturing
zhìzào
制造
capability / capacity
nénglì
能力
development / buildup
jiànshè
建设
[particle]
de
的
investment / input
tóurù
投入
,
geopolitics
dìyuán zhèngzhì
地缘政治
factors
yīnsù
因素
is
zhèng
正
profoundly / deeply
shēnkè
深刻
reshaping / reconstructing
chóngsù
重塑
global
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
supply chain
gōngyìng liàn
供应链
landscape / configuration
géjú
格局
。
analysts
fēnxī rénshì
分析人士
point out
zhǐchū
指出
,
if
ruò
若
Strait of Hormuz
Huòěrmùzī Hǎixiá
霍尔木兹海峡
crisis
wēijī
危机
leads to / causes
dǎozhì
导致
the Middle East
Zhōngdōng
中东
energy
néngyuán
能源
prices
jiàgé
价格
long-term
chángqī
长期
remaining high / elevated
gāoqǐ
高企
,
semiconductor
bàndǎotǐ
半导体
manufacturing
zhìzào
制造
energy consumption
nénghaò
能耗
costs
chéngběn
成本
will
jiāng
将
accordingly / consequently
suízhī
随之
to rise / to climb
pānshēng
攀升
,
on
duì
对
overall
zhěngtǐ
整体
industry
hángyè
行业
profit / margins
lìrùn
利润
to produce / to have
chǎnshēng
产生
unfavorable / adverse
bùlì
不利
impact / effect
yǐngxiǎng
影响
。

New Words

bàndǎotǐ
半导体
semiconductor
shìchǎng xiāoshòu'é
市场销售额
market sales revenue
réngōng zhìnéng
人工智能
artificial intelligence
jīchǔ shèshī
基础设施
infrastructure
xīnpiàn
芯片
chips
shēngchéngshì AI
生成式AI
generative AI
gōngyìng liàn
供应链
supply chain
dìyuán zhèngzhì
地缘政治
geopolitics
píngjǐng
瓶颈
bottleneck
chǎnnéng
产能
production capacity

News in English

Science & Technology

AI Demand Pushes Global Semiconductor Sales to Approach 1 Trillion Dollars in 2026

Industry research firms project that global semiconductor market sales will approach 975.5 billion dollars in 2026, driven by AI infrastructure development demand. Generative AI chip revenue alone is expected to exceed 500 billion dollars.

According to Deloitte's latest report, the global semiconductor market sales revenue is projected to approach 975.5 billion US dollars in 2026, just one step away from the historic one trillion dollar milestone.

This growth is primarily driven by the massive demand for artificial intelligence infrastructure development. Generative AI chip revenue alone is projected to exceed 500 billion US dollars, accounting for approximately half of the total semiconductor sales revenue.

In sub-segments, both logic chips and memory chips are showing year-over-year growth exceeding 30 percent, a trend rarely seen in recent years.

As the global leader in advanced chip manufacturing, TSMC is currently facing enormous production capacity demands from major technology companies.

However, supply bottlenecks in High Bandwidth Memory (HBM) and insufficient advanced packaging capacity are currently constraining the overall shipment scale of AI accelerator chips.

ASML, the Dutch semiconductor equipment giant, has indicated that customers are significantly accelerating their capacity expansion plans, demonstrating long-term confidence in AI-driven demand.

Meanwhile, China is intensifying its investment in domestic chip design and manufacturing capabilities under export control pressure, and geopolitical factors are profoundly reshaping the global semiconductor supply chain landscape.

Analysts point out that if prolonged energy price hikes due to the Strait of Hormuz crisis significantly raise semiconductor manufacturing energy costs, the entire industry's profit margins will be adversely affected.

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OpenAI (AI company)
OpenAI
OpenAI
to announce / to declare
xuānbù
宣布
to postpone / to delay
tuīchí
推迟
IPO / to go public
shàngshì
上市
plan
jìhuà
计划
,
CEO / Chief Executive Officer
shǒuxí zhíxíng guān
首席执行官
stated / said
chēng
称
now / at this time
xiànzài
现在
timing / moment
shíjī
时机
inappropriate / ill-advised
bùdàng
不当
。

OpenAI Delays IPO Plans as CEO Sam Altman Cites AI Safety Concerns

Apple Inc.
píngguǒ gōngsī
苹果公司
officially / formally
zhèngshì
正式
to release / to launch
fābù
发布
iPhone 18 Pro (Apple flagship smartphone)
iPhone 18 Pro
iPhone 18 Pro
and / simultaneously
bìng
并
to roll out / to introduce
tuīchū
推出
iOS 27 (Apple mobile operating system)
iOS 27
iOS 27
operating system
xìtǒng
系统
update / upgrade
gēngxīn
更新
。

Apple Officially Launches iPhone 18 Pro and Rolls Out iOS 27 Update

Beijing
běijīng
北京
respond
huíyìng
回应
Anthropic
Anthropic
Anthropic
CEO
CEO
CEO
artificial intelligence
AI
AI
development
fāzhǎn
发展
。

Beijing Responds to Anthropic CEO Remarks on China AI Development

United States
měiguó
美国
investigation
diàochá
调查
indicate
zhǐ
指
China
zhōngguó
中国
government
zhèngfǔ
政府
participate
cānyù
参与
artificial intelligence
AI
AI
technology
jìshù
技术
theft
dàoqiè
盗窃
。

US Investigators Link China to AI Technology Theft