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commerce
shāng yè
商业
·HSK 4

research / analytics firm
fēnxī jīgòu
分析机构
to forecast / to predict
yùcè
预测
global
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
market
shìchǎng
市场
2026
2026 nián
2026年
will
jiāng
for the first time
shǒucì
首次
to break through / to surpass
tūpò
突破
one trillion US dollars
yī wànyì měiyuán
一万亿美元

IDC (International Data Corporation)
Guójì Shùjù Gōngsī
国际数据公司
to forecast
yùcè
预测
driven by / due to
shòu
artificial intelligence
rén gōng zhìnéng
人工智能
infrastructure
jīchǔ shèshī
基础设施
demand
xūqiú
需求
to drive / to propel
tuīdòng
推动
2026
2026 nián
2026年
global
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
market
shìchǎng
市场
scale / size
guīmó
规模
is expected to
yùjì
预计
to reach
dádào
达到
$1.29 trillion
1.29 wànyì měiyuán
1.29万亿美元
year-over-year
tóngbǐ
同比
to grow / growth
zēngzhǎng
增长
52.8 percent
52.8%
52.8%

May 19, 2026 at 1:00 PM

IDC (International Data Corporation)
Guójì Shùjù Gōngsī
国际数据公司
latest
zuìxīn
最新
forecast
yùcè
预测
shows
xiǎnshì
显示
2026
2026 nián
2026年
global
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
market
shìchǎng
市场
scale
guīmó
规模
will
jiāng
reach
dádào
达到
$1.29 trillion
1.29 wànyì měiyuán
1.29万亿美元
for the first time
shǒucì
首次
to surpass / to exceed
chāoguò
超过
one trillion
yī wànyì
一万亿
US dollars
měiyuán
美元
milestone / threshold
dàguān
大关
this
zhè yī
这一
growth
zēngzhǎng
增长
mainly / primarily
zhǔyào
主要
driven by / by
yóu
artificial intelligence
rén gōng zhìnéng
人工智能
infrastructure
jīchǔ shèshī
基础设施
investment
tóuzī
投资
high-bandwidth memory (HBM)
gāo dàikuān nèicún
高带宽内存
as well as / and
yǐjí
以及
hyperscale
chāo dà guīmó
超大规模
data centers
shùjù zhōngxīn
数据中心
construction / development
jiànshè
建设
driven by / pushed by
tuīdòng
推动
among these
qízhōng
其中
DRAM (Dynamic Random Access Memory)
dòngtài suíjī cúnqǔ cúnchúqì
动态随机存取存储器
revenue
shōurù
收入
is projected to
yùjì
预计
in
zài
2026
2026 nián
2026年
nearly / almost
jìnhū
近乎
to nearly triple
zēng zhì sān bèi
增至三倍
to reach
dádào
达到
$418.6 billion
4186 yì měiyuán
4186亿美元
artificial intelligence
rén gōng zhìnéng
人工智能
chips
xīnpiàn
芯片
arms race / intense competition
jūnbèi jìngsài
军备竞赛
and
China-US
Zhōng-Měi
中美
technology
kējì
科技
competition
jìngzhēng
竞争
is currently
zhèngzài
正在
to reshape / to transform
chóngsù
重塑
global
quánqiú
全球
semiconductor
bàndǎotǐ
半导体
supply chain
gōngyìng liàn
供应链
United States
Měiguó
美国
major
gè dà
各大
national
guójiā
国家
laboratories
shíyànshì
实验室
are currently
zhèngzài
正在
to explore
tànsuǒ
探索
beyond / surpassing
chāoyuè
超越
traditional / conventional
chuántǒng
传统
chip
xīnpiàn
芯片
suppliers
gōngyìng shāng
供应商
(possessive particle)
de
new types of
xīn xíng
新型
computing
jìsuàn
计算
architecture
jiàgòu
架构
to
to meet / to handle
yìngduì
应对
AI
rén gōng zhìnéng
人工智能
workloads
gōngzuò fùzài
工作负载
demands
xūqiú
需求
Europe
Ōuzhōu
欧洲
officials
guānyuán
官员
and
entrepreneurs / startup founders
chuàngyè zhě
创业者
on the other hand / meanwhile
to warn
jǐnggào
警告
if
ruò
if not accelerating
bù jiākuài
不加快
domestic / home-grown
běntǔ
本土
chip
xīnpiàn
芯片
and
cloud computing
yún jìsuàn
云计算
investment
tóuzī
投资
Europe
Ōuzhōu
欧洲
will
jiāng
on
duì
American
Měiguó
美国
dominated
zhǔdǎo de
主导的
AI
rén gōng zhìnéng
人工智能
infrastructure
jīchǔ shèshī
基础设施
to develop
chǎnshēng
产生
dependence
yīlài
依赖

New Words

bàndǎotǐ
半导体
semiconductor
tūpò
突破
to break through
guīmó
规模
scale
jīchǔ shèshī
基础设施
infrastructure
gāo dàikuān nèicún
高带宽内存
high-bandwidth memory
chāo dà guīmó
超大规模
hyperscale
shùjù zhōngxīn
数据中心
data center
gōngyìng liàn
供应链
supply chain
xīnpiàn
芯片
chip
jiàgòu
架构
architecture

News in English

Business

Semiconductor Market Forecast to Surpass One Trillion Dollars in 2026 as AI Demand Drives Supercycle

IDC forecasts that the global semiconductor market will reach $1.29 trillion in 2026, a 52.8 percent year-over-year increase driven by AI infrastructure demand.

International Data Corporation's latest forecast shows that the global semiconductor market in 2026 will reach $1.29 trillion in scale, for the first time surpassing the one trillion dollar milestone.

This growth is primarily driven by investments in artificial intelligence infrastructure, high-bandwidth memory (HBM), and the construction of hyperscale data centers.

Among these, DRAM revenue is projected to nearly triple in 2026, reaching $418.6 billion.

The AI chip arms race and U.S.-China technology competition are reshaping the global semiconductor supply chain.

The United States' major national laboratories are currently exploring new computing architectures beyond traditional chip suppliers to address AI workload demands.

European officials and entrepreneurs have warned that without accelerating investments in domestic chips and cloud computing, Europe will develop dependence on American-dominated AI infrastructure.

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美国
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股市
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