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technology
kē jì
科技
·HSK 2

science
kē
科
technology
jì
技
chip
xīn
芯
piece
piàn
片
public
gōng
公
company
sī
司
obtain
huò
获
get
de
得
six
liùshí
6
thousand
qiān
千
ten thousand
wàn
万
US
měi
美
dollar
yuán
元
fusion
róng
融
fund
zī
资
。

total
zǒng
总
department
bù
部
position
wèi
位
at
yú
于
US
měi
美
country
guó
国
add
jiā
加
state
zhōu
州
of
de
的
science
kē
科
technology
jì
技
chip
xīn
芯
piece
piàn
片
public
gōng
公
company
sī
司
science
kē
科
technology
jì
技
chip
xīn
芯
piece
piàn
片
complete
wán
完
become
chéng
成
complete
le
了
one
yī
一
round
lún
轮
sixty
liùshí
6
ten thousand
wàn
万
US
měi
美
dollar
yuán
元
fusion
róng
融
fund
zī
资
,
by
yóu
由
seal
sāi
塞
benefit
lì
利
case
gé
格
man
màn
曼
wind
fēng
风
risk
xiǎn
险
public
gōng
公
company
sī
司
lead
lǐng
领
guide
dǎo
导
。

April 2, 2026 at 8:00 AM

science
kē
科
technology
jì
技
chip
xīn
芯
piece
piàn
片
public
gōng
公
company
sī
司
announce
xuān
宣
publish
bù
布
fusion
róng
融
fund
zī
资
become
chéng
成
success
gōng
功
。
this
zhè
这
home
jiā
家
public
gōng
公
company
sī
司
position
wèi
位
at
yú
于
US
měi
美
country
guó
国
add
jiā
加
state
zhōu
州
。
public
gōng
公
company
sī
司
use
shǐ
使
use
yòng
用
person
rén
人
work
gōng
工
wisdom
zhì
智
can
néng
能
set
shè
设
design
jì
计
chip
xīn
芯
piece
piàn
片
。
that
gāi
该
technology
jì
技
art
shù
术
can
néng
能
lower
jiàng
降
low
dī
低
open
kāi
开
develop
fā
发
become
chéng
成
root
běn
本
super
chāo
超
pass
guò
过
seventy five
qīshíwǔ
75
percent
báifēnzhī
%
。
England
yīng
英
special
tè
特
two
ěr
尔
public
gōng
公
company
sī
司
first
shǒu
首
seat
xí
席
hold
zhí
执
execute
xíng
行
official
guān
官
add
jiā
加
enter
rù
入
public
gōng
公
company
sī
司
director
dǒng
董
business
shì
事
will
huì
会
。
截
ji截截
截
until
zhì
至
four
sì
4
month
yuè
月
one
yī
1
day
rì
日
,
that
gāi
该
public
gōng
公
company
sī
司
fusion
róng
融
fund
zī
资
total
zǒng
总
amount
é
额
reach
dá
达
to
dào
到
nine
jiǔ
9
thousand
qiān
千
three
sān
3
hundred
bǎi
百
ten thousand
wàn
万
US
měi
美
dollar
yuán
元
。

New Words

jiào
教
teach
yù
育
nurture
gǎi
改
change
gé
革
revolution
xué
学
study
xiào
校
school
shù
数
number
zì
字
character
hù
互
mutual
lián
联
link
wǎng
网
network
xué
学
study

News in English

Science & Technology

Cognichip Raises 60 Million Dollars in Series A Funding for AI Chip Design

Cognichip, a US-based semiconductor company, completed a 60 million dollar Series A financing round led by Seligman Ventures.

Educational reforms focus on digital learning integration. Schools implement new teaching methodologies worldwide. Student engagement improves through interactive technology. Teachers receive training for modern educational approaches. The shift addresses changing workplace skill demands.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
,
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
,
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products