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technology
kē jì
科技
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United States
Měiguó
美国
chip
xīnpiàn
芯片
act
fǎ àn
法案
drives
cù jìn
促进
domestic
guó nèi
国内
chip
xīnpiàn
芯片
manufacturing
zhìzào
制造
。

2023
2023 nián
2023年
to
zhì
至
2024
2024 nián
2024年
,
United States
Měiguó
美国
chip
xīnpiàn
芯片
and
hé
和
science
kē xué
科学
act
fǎ àn
法案
for
wéi
为
domestic
guó nèi
国内
chip
xīnpiàn
芯片
manufacturing
zhìzào
制造
investment
tóu rù
投入
particle
le
了
52.7 billion US dollars
527 yì měi yuán
527亿美元
。

August 31, 2024 at 10:00 AM

2022
2022 nián
2022年
August
8 yuè
8月
,
United States
Měiguó
美国
president
zǒng tǒng
总统
Biden
bài dēng
拜登
signed
qiān shǔ
签署
particle
le
了
chip
xīnpiàn
芯片
and
hé
和
science
kē xué
科学
act
fǎ àn
法案
。
this
gāi
该
act
fǎ àn
法案
aims to
zhǐ zài
旨在
encourage
gǔ lì
鼓励
chip
xīnpiàn
芯片
manufacturing
zhìzào
制造
return to
huí guī
回归
United States
Měiguó
美国
homeland
běn tǔ
本土
。
2023
2023 nián
2023年
and
hé
和
2024
2024 nián
2024年
period
qī jiān
期间
,
multiple
duō jiā
多家
global
quán qiú
全球
leading
dǐng jí
顶级
chip
xīnpiàn
芯片
manufacturers
zhìzào
制造
companies
qǐ yè
企业
announced
xuān bù
宣布
particle
le
了
in
zài
在
United States
Měiguó
美国
build plants
jiàn chǎng
建厂
or
huò
或
expand
kuò chǎn
扩产
possessive particle
de
的
plans
jì huà
计划
。
Taiwan Semiconductor Manufacturing Company
Táijī diàn
台积电
announced
xuān bù
宣布
will
jiāng
将
in
zài
在
Arizona
Yàlìzànànà zhōu
亚利桑那州
invest
tóu zī
投资
12 billion US dollars
120 yì měi yuán
120亿美元
build
jiàn shè
建设
three
sān zuò
三座
fabs
jīngyuán chǎng
晶圆厂
。
Intel
yīng tè ěr
英特尔
also
yě
也
received
huò dé
获得
particle
le
了
8.5 billion US dollars
85 yì měi yuán
85亿美元
possessive particle
de
的
government
zhèng fǔ
政府
grants
bǔ zhù
补助
and
hé
和
11 billion US dollars
110 yì měi yuán
110亿美元
possessive particle
de
的
loans
dài kuǎn
贷款
。
Samsung
sān xīng
三星
and
hé
和
Micron
měi guāng
美光
etc
děng
等
companies
gōng sī
公司
also
yě
也
announced
xuān bù
宣布
particle
le
了
similar
lèi sì
类似
possessive particle
de
的
investments
tóu zī
投资
。
according to
gēn jù
根据
United States
Měiguó
美国
commerce
shāng wù
商务
department
bù
部
possessive particle
de
的
data
shù jù
数据
,
by
dào
到
2024
2024 nián
2024年
August
8 yuè
8月
as of
wéi zhǐ
为止
,
chip
xīnpiàn
芯片
act
fǎ àn
法案
has
yǐ
已
catalyzed
dài dòng
带动
particle
le
了
over
chāo guò
超过
158 billion US dollars
1580 yì měi yuán
1580亿美元
possessive particle
de
的
private
sī rén
私人
sector
bù mén
部门
investments
tóu zī
投资
。

New Words

xinpian
芯片
chip
kexue
科学
science
faan
法案
act
zhizao
制造
manufacturing
Meiguo
美国
United States
Taiji dian
台积电
TSMC
Yalisangna zhou
亚利桑那州
Arizona
buzhu
补助
grants
daikuan
贷款
loans
touzi
投资
investment

News in English

Science & Technology

CHIPS Act Semiconductor Progress

CHIPS Act Semiconductor Progress

The US government signed the Chips and Science Act in August 2022.

The legislation aimed to encourage chip manufacturing to return to the United States. During 2023 and 2024, multiple global leading chip manufacturers announced plans to build or expand facilities in America. Taiwan Semiconductor Manufacturing Company announced 12 billion dollar investment to build three fabs in Arizona.

Intel received 8.5 billion dollars in government grants and 11 billion dollars in loans. Samsung and Micron announced similar investments. According to US Commerce Department data, by August 2024, the Chips Act had catalyzed over 158 billion dollars in private sector investments.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
,
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
,
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products