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technology
kē jì
科技
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Apple (company)
Píngguǒ
苹果
with / and
yǔ
与
Intel (chip company)
Yīngtèěr
英特尔
to reach / to conclude (a deal)
dáchéng
达成
chip
xīnpiàn
芯片
contract manufacturing
dàigōng
代工
agreement
xiéyì
协议
。

Apple (company)
Píngguǒ
苹果
and
hé
和
Intel (chip company)
Yīngtèěr
英特尔
to reach / to conclude
dáchéng
达成
agreement
xiéyì
协议
，
Intel
Yīngtèěr
英特尔
will
jiāng
将
for
wèi
为
Apple
Píngguǒ
苹果
to produce / to manufacture
shēngchǎn
生产
some / part of
bùfèn
部分
chips
xīnpiàn
芯片
。

June 27, 2026 at 3:30 AM

Apple (company)
Píngguǒ
苹果
and
hé
和
Intel (chip company)
Yīngtèěr
英特尔
to reach / to conclude
dáchéng
达成
completion particle
le
了
one item / an (agreement)
yī xiàng
一项
chip
xīnpiàn
芯片
contract manufacturing
dàigōng
代工
agreement
xiéyì
协议
。
Intel
Yīngtèěr
英特尔
will
jiāng
将
in
zài
在
United States
Měiguó
美国
factory
gōngchǎng
工厂
for
wèi
为
Apple
Píngguǒ
苹果
to produce / manufacture
shēngchǎn
生产
chips
xīnpiàn
芯片
。
these
zhèxiē
这些
chips
xīnpiàn
芯片
are not
bú shì
不是
Apple
Píngguǒ
苹果
most important
zuì zhòngyào
最重要
structural particle
de
的
products
chǎnpǐn
产品
，
but rather
érshì
而是
some / certain
yīxiē
一些
low-end
dīduān
低端
components / parts
bùjiàn
部件
。
TSMC (chip manufacturer)
Táijīdiàn
台积电
still / as before
réngrán
仍然
to be responsible for
fùzé
负责
Apple
Píngguǒ
苹果
more than
chāoguò
超过
ninety percent / 90%
bǎifēnzhī jiǔshí
百分之九十
structural particle
de
的
chips
xīnpiàn
芯片
production
shēngchǎn
生产
。
United States
Měiguó
美国
president
zǒngtǒng
总统
Trump (person name)
Tèlǎngpǔ
特朗普
to announce
xuānbù
宣布
completion particle
le
了
this
zhège
这个
news / information
xiāoxi
消息
。
Apple
Píngguǒ
苹果
possibly / may
kěnéng
可能
first
xiān
先
to use
yòng
用
Intel
Yīngtèěr
英特尔
structural particle
de
的
factory
gōngchǎng
工厂
to manufacture
shēngchǎn
生产
MacBook Air (laptop computer)
MacBook Air
MacBook Air
related / relevant
xiāngguān
相关
structural particle
de
的
chips
xīnpiàn
芯片
。

News in English

Science & Technology

Apple and Intel Reach Chip Manufacturing Agreement in the United States

Apple and Intel have reached an agreement where Intel will manufacture some chips for Apple.

More in Science & Technology

former / previous
qián
前
Groq (AI chip startup)
Groq
Groq
engineers
gōngchéngshī
工程师
regarding / over (a matter)
jiù
就
$20 billion USD
200 yì měiyuán
200亿美元
Nvidia (US semiconductor company)
Yīngwěidá
英伟达
licensing / authorization
shòuquán
授权
deal / transaction
jiāoyì
交易
to file / to initiate
tíqǐ
提起
a lawsuit / legal action
sùsòng
诉讼
。

Former Groq Engineers Sue Board Over $20 Billion Nvidia Licensing Deal

Qualcomm (US semiconductor company)
Gāotōng
高通
for the first time
shǒucì
首次
to / toward
xiàng
向
Huawei (Chinese tech company)
Huáwéi
华为
to pay / to make a payment
zhīfù
支付
patent royalties / licensing fee
zhuānlì fèi
专利费
，
both parties
shuāngfāng
双方
to sign / to conclude
qiānshǔ
签署
multi-year period
duō nián qī
多年期
agreement / deal
xiéyì
协议
。

Qualcomm Pays Huawei for First Time in Broad Multi-Year Patent Licensing Agreement

Tencent (Chinese tech company)
Téngxùn
腾讯
from / toward
xiàng
向
Oracle (US tech corporation)
Jiǎgǔwén
甲骨文
to lease / to rent for use
zūyòng
租用
one hundred thousand
shí wàn
十万
measure word for small round objects
kē
颗
artificial intelligence
réngōng zhìnéng
人工智能
semiconductor chip / microchip
xīnpiàn
芯片
。

Tencent Leases 100,000 AI Chips From Oracle in $7 Billion Deal

Apple Inc.
Píngguǒ Gōngsī
苹果公司
to announce
xuānbù
宣布
will (future marker)
jiāng
将
on / at (preceding a date)
yú
于
October 13th
shíyuè shísān rì
十月十三日
to hold (an event)
jǔxíng
举行
Welcome Home (name of Apple event)
Welcome Home
Welcome Home
product launch event
fābùhuì
发布会
，
expected to
yùjì
预计
to launch / to introduce
tuīchū
推出
HomePad mini (Apple smart home display)
HomePad mini
HomePad mini
and others / etc.
děng
等
new-model
xīnkuǎn
新款
products
chǎnpǐn
产品
。

Apple Announces October 13 Welcome Home Event, Expected to Reveal HomePad Mini and Other New Products