Apple (company)Píngguǒ苹果with / andyǔ与Intel (chip company)Yīngtèěr英特尔to reach / to conclude (a deal)dáchéng达成chipxīnpiàn芯片contract manufacturingdàigōng代工agreementxiéyì协议。
Apple (company)
Píngguǒ
苹果
with / and
yǔ
与
Intel (chip company)
Yīngtèěr
英特尔
to reach / to conclude (a deal)
dáchéng
达成
chip
xīnpiàn
芯片
contract manufacturing
dàigōng
代工
agreement
xiéyì
协议
Apple (company)
Píngguǒ
苹果
and
hé
和
Intel (chip company)
Yīngtèěr
英特尔
to reach / to conclude
dáchéng
达成
agreement
xiéyì
协议
Intel
Yīngtèěr
英特尔
will
jiāng
将
for
wèi
为
Apple
Píngguǒ
苹果
to produce / to manufacture
shēngchǎn
生产
some / part of
bùfèn
部分
chips
xīnpiàn
芯片
June 27, 2026 at 3:30 AM
Apple (company)
Píngguǒ
苹果
and
hé
和
Intel (chip company)
Yīngtèěr
英特尔
to reach / to conclude
dáchéng
达成
completion particle
le
了
one item / an (agreement)
yī xiàng
一项
chip
xīnpiàn
芯片
contract manufacturing
dàigōng
代工
agreement
xiéyì
协议
Intel
Yīngtèěr
英特尔
will
jiāng
将
in
zài
在
United States
Měiguó
美国
factory
gōngchǎng
工厂
for
wèi
为
Apple
Píngguǒ
苹果
to produce / manufacture
shēngchǎn
生产
chips
xīnpiàn
芯片
these
zhèxiē
这些
chips
xīnpiàn
芯片
are not
bú shì
不是
Apple
Píngguǒ
苹果
most important
zuì zhòngyào
最重要
structural particle
de
的
products
chǎnpǐn
产品
but rather
érshì
而是
some / certain
yīxiē
一些
low-end
dīduān
低端
components / parts
bùjiàn
部件
TSMC (chip manufacturer)
Táijīdiàn
台积电
still / as before
réngrán
仍然
to be responsible for
fùzé
负责
Apple
Píngguǒ
苹果
more than
chāoguò
超过
ninety percent / 90%
bǎifēnzhī jiǔshí
百分之九十
structural particle
de
的
chips
xīnpiàn
芯片
production
shēngchǎn
生产
United States
Měiguó
美国
president
zǒngtǒng
总统
Trump (person name)
Tèlǎngpǔ
特朗普
to announce
xuānbù
宣布
completion particle
le
了
this
zhège
这个
news / information
xiāoxi
消息
Apple
Píngguǒ
苹果
possibly / may
kěnéng
可能
first
xiān
先
to use
yòng
用
Intel
Yīngtèěr
英特尔
structural particle
de
的
factory
gōngchǎng
工厂
to manufacture
shēngchǎn
生产
MacBook Air (laptop computer)
MacBook Air
MacBook Air
related / relevant
xiāngguān
相关
structural particle
de
的
chips
xīnpiàn
芯片
News in English
Science & TechnologyApple and Intel Reach Chip Manufacturing Agreement in the United States
Apple and Intel have reached an agreement where Intel will manufacture some chips for Apple.
More in Science & Technology
OpenAI (AI company)OpenAIOpenAIto considerkǎolǜ考虑will / tojiāng将to go public / IPOshàngshì上市to postpone / to delaytuīchí推迟until / tozhì至the year 20272027 nián2027年。
OpenAI (AI company)
OpenAI
OpenAI
to consider
kǎolǜ
考虑
will / to
jiāng
将
to go public / IPO
shàngshì
上市
to postpone / to delay
tuīchí
推迟
until / to
zhì
至
the year 2027
2027 nián
2027年
OpenAI Considers Delaying IPO Until 2027 After SpaceX Stock Volatility
DeepSeek (AI company name)Shēndù Qiúsuǒ深度求索to complete / to finishwánchéng完成first round (of funding)shǒu lún首轮external / outsidewàibù外部to raise funds / financingróngzī融资，valuationgūzhí估值to exceed / to surpasschāoguò超过$50 billion500 yì měiyuán500亿美元。
DeepSeek (AI company name)
Shēndù Qiúsuǒ
深度求索
to complete / to finish
wánchéng
完成
first round (of funding)
shǒu lún
首轮
external / outside
wàibù
外部
to raise funds / financing
róngzī
融资
valuation
gūzhí
估值
to exceed / to surpass
chāoguò
超过
$50 billion
500 yì měiyuán
500亿美元
DeepSeek Completes First External Funding Round at Over $50 Billion Valuation
AlibabaĀlǐbābā阿里巴巴Qwentōngyì通义Qwenqiānwèn千问Appyìngyòng应用openskāifàng开放third-partydì sān fāng第三方agentzhìnéng tǐ智能体integrationjiērù接入。
Alibaba
Ālǐbābā
阿里巴巴
Qwen
tōngyì
通义
Qwen
qiānwèn
千问
App
yìngyòng
应用
opens
kāifàng
开放
third-party
dì sān fāng
第三方
agent
zhìnéng tǐ
智能体
integration
jiērù
接入
Alibaba Qwen App Opens Platform to Third-Party AI Agents
Alipayzhīfù bǎo支付宝launchtuīchū推出artificial intelligenceréngōng zhìnéng人工智能assistantzhùshǒu助手Abaoābǎo阿宝。
Alipay
zhīfù bǎo
支付宝
launch
tuīchū
推出
artificial intelligence
réngōng zhìnéng
人工智能
assistant
zhùshǒu
助手
Abao
ābǎo
阿宝
Alipay Launches AI Assistant Abao