technology
kē jì
科技
Siemens
Xīménzǐ
西门子
and / together with
yǔ
与
TSMC / Taiwan Semiconductor Manufacturing Company
Táijīdiàn
台积电
to expand / to broaden
kuòdà
扩大
cooperation / partnership
hézuò
合作
jointly / together
gòngtóng
共同
to advance / to promote
tuījìn
推进
artificial intelligence / AI
réngōng zhìnéng
人工智能
driven by / powered by
qūdòng
驱动
[structural particle]
de
的
chip / semiconductor
xīnpiàn
芯片
design
shèjì
设计
automation / automated processes
zìdònghuà
自动化
Siemens
Xīménzǐ
西门子
and / together with
yǔ
与
TSMC
Táijīdiàn
台积电
recently / in recent days
jìnrì
近日
to announce / to declare
xuānbù
宣布
to continue / to extend
yánxù
延续
and also / as well as
bìng
并
to deepen / to strengthen
shēnhuà
深化
partnership / collaborative relationship
hézuò huǒbàn guānxi
合作伙伴关系
key focus / emphasis
zhòngdiǎn
重点
to advance / to promote
tuījìn
推进
artificial intelligence / AI
réngōng zhìnéng
人工智能
driven by / powered by
qūdòng
驱动
[structural particle]
de
的
semiconductor
bàndǎotǐ
半导体
design
shèjì
设计
automation
zìdònghuà
自动化
tool / instrument
gōngjù
工具
Siemens
Xīménzǐ
西门子
under / subsidiary of
qíxià
旗下
[structural particle]
de
的
EDA / electronic design automation
diànzǐ shèjì zìdònghuà
电子设计自动化
tools / software
gōngjù
工具
already
yǐ
已
to complete / to achieve
wánchéng
完成
TSMC
Táijīdiàn
台积电
multiple / several
duō xiàng
多项
top-tier / cutting-edge
dǐngjiān
顶尖
process technology / manufacturing node
zhìchéng jìshù
制程技术
[structural particle]
de
的
certification / validation
rènzhèng
认证
including / to include
bāokuò
包括
N2P [2nm+ process node]
N2P
N2P
and
hé
和
A16 [advanced process node]
A16
A16
and other / among others
děng
等
node / process node
jiédiǎn
节点
April 27, 2026 at 12:30 PM
Siemens
Xīménzǐ
西门子
and / together with
yǔ
与
TSMC / Taiwan Semiconductor Manufacturing Company
Táijīdiàn
台积电
late April / the last ten days of April
4 yuè xià xún
4月下旬
to announce / to declare
xuānbù
宣布
to deepen / to strengthen
shēnhuà
深化
cooperation / partnership
hézuò
合作
jointly / together
gòngtóng
共同
to advance / to promote
tuījìn
推进
artificial intelligence / AI
réngōng zhìnéng
人工智能
driven by / powered by
qūdòng
驱动
[structural particle]
de
的
semiconductor
bàndǎotǐ
半导体
design
shèjì
设计
automation
zìdònghuà
自动化
technology
jìshù
技术
cooperation / collaboration
hézuò
合作
key focus / emphasis
zhòngdiǎn
重点
to include / including
bāokuò
包括
to use / to leverage
lìyòng
利用
artificial intelligence / AI
réngōng zhìnéng
人工智能
to automatically correct / automated fixing
zìdòng xiūzhèng
自动修正
chip / semiconductor
xīnpiàn
芯片
design rule check / DRC [chip design verification step]
shèjì guīzé jiǎnchá
设计规则检查
in / within
zhōng
中
[structural particle]
de
的
error / mistake
cuòwù
错误
to improve / to enhance
tíshēng
提升
design workflow / design process
shèjì liúchéng
设计流程
efficiency / productivity
xiàolǜ
效率
Siemens
Xīménzǐ
西门子
[structural particle]
de
的
EDA / electronic design automation
diànzǐ shèjì zìdònghuà
电子设计自动化
tools / software tools
gōngjù
工具
already
yǐ
已
to complete / to achieve
wánchéng
完成
TSMC
Táijīdiàn
台积电
multiple / several
duō xiàng
多项
top-tier / cutting-edge
dǐngjiān
顶尖
process technology / manufacturing node
zhìchéng jìshù
制程技术
certification / validation
rènzhèng
认证
to cover / to encompass
hángài
涵盖
N2P [2nm+ process node]
N2P
N2P
A16 [advanced process node]
A16
A16
and
hé
和
A14 [advanced process node]
A14
A14
and other / among others
děng
等
advanced / cutting-edge
xiānjìn
先进
node / process node
jiédiǎn
节点
both parties / both sides
shuāngfāng
双方
cooperation
hézuò
合作
also / in addition
hái
还
to extend / to expand
yánshēn
延伸
to / into [a domain]
zhì
至
silicon photonics
guī guāngzǐ xué
硅光子学
domain / field
lǐngyù
领域
Siemens
Xīménzǐ
西门子
[structural particle]
de
的
tools
gōngjù
工具
now / currently already
xiàn yǐ
现已
to support / to enable
zhīchí
支持
TSMC
Táijīdiàn
台积电
Compact Universal Photonic Engine [TSMC technology]
jǐncòu xíng tōngyòng guāngzǐ yǐnqíng
紧凑型通用光子引擎
technology
jìshù
技术
[structural particle]
de
的
design
shèjì
设计
and
hé
和
verification / validation
yànzhèng
验证
this / this round of
cǐcì
此次
cooperation / collaboration
hézuò
合作
[passive marker]
bèi
被
the industry / the sector
yèjiè
业界
to regard as / to consider as
shì wéi
视为
artificial intelligence / AI
réngōng zhìnéng
人工智能
comprehensive / across-the-board
quánmiàn
全面
to penetrate / to permeate
shèntòu
渗透
chip / semiconductor
xīnpiàn
芯片
manufacturing / fabrication
zhìzào
制造
upstream / early-stage
shàngyóu
上游
segment / link in the chain
huánjié
环节
[structural particle]
de
的
important / significant
zhòngyào
重要
milestone / landmark achievement
lǐchéng bēi
里程碑
as / along with
suízhe
随着
artificial intelligence / AI
réngōng zhìnéng
人工智能
demand / requirements
xūqiú
需求
to continue / ongoing
chíxù
持续
to drive / to propel
tuīdòng
推动
semiconductor
bàndǎotǐ
半导体
industry / sector
hángyè
行业
to expand / expansion
kuòzhāng
扩张
chip / semiconductor
xīnpiàn
芯片
design tools / design software
shèjì gōngjù
设计工具
[structural particle]
de
的
automation
zìdònghuà
自动化
to upgrade / upgrade
shēngjí
升级
is considered to be / is regarded as
bèi rènwéi shì
被认为是
to shorten / to reduce
suōduǎn
缩短
R&D / research and development
yánfā
研发
cycle / timeframe
zhōuqī
周期
to reduce / to lower
jiàngdī
降低
cost / expenses
chéngběn
成本
[structural particle]
de
的
key / critical
guānjiàn
关键
pathway / approach
tújìng
途径